Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Full-spectrum white LED device

A LED device, full-spectrum technology, applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of immature coating technology of white reflective glue, inability to effectively cover the silver plating layer, and inability to guarantee product reliability. Good uniformity, good use effect, and effect of improving tolerance

Pending Publication Date: 2019-02-15
北京宇极芯光光电技术有限公司 +1
View PDF5 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the low reflectivity of the gold-plated layer, it is impossible to ensure product reliability while taking into account high light efficiency (usually the use of gold-plated layer will cause the light effect to be halved)
On the other hand, due to the immature coating technology of white reflective glue, it cannot effectively cover the silver plating layer to suppress device attenuation.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Full-spectrum white LED device
  • Full-spectrum white LED device
  • Full-spectrum white LED device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] The device packaging process is as follows:

[0039] 1. Die-bonding: use common die-bonding glue to fix the LED chip on the dispensing area 1 of the bracket 8 , and in this embodiment, select the near-ultraviolet LED chip 5 with a luminous peak wavelength at 405nm.

[0040] 2. Spot welding: connect the positive and negative poles of the LED chip 5 to the positive and negative poles 2 on the front side of the bracket respectively through gold wires, and spot welding forms a path, and the solder joints 6 completely cover the positive and negative poles 2 .

[0041] 3. Glue dispensing: mix the mixed colloid containing red, green and blue fluorescent powder 7 according to a certain proportion, stir evenly, and put it on the chip in dispensing area 1 after vacuum defoaming.

[0042] The composition formula of red phosphor is: CaAlSi(ON )3 : Eu, the peak wavelength of the emission spectrum is 620-650nm, and the half-maximum width is 105-135nm;

[0043] The composition formu...

Embodiment 2

[0050] With the technology of embodiment 1, adjust phosphor proportion, use support of the present invention and general commercially available alumina ceramic support (silver-plated layer is filled with luminous area) to pack into warm white 3200K full-spectrum LED device, and emission spectrum is as follows: Figure 8 shown. The light efficacy of both is 80lm / W.

[0051] Both were lighted and aged in an aging box, and the aging conditions were the same as in Example 1. Such as Figure 9 Compared with the aging characteristics shown, the present invention adopts the hidden silver plating layer design, and the reliability of the packaged device is good. According to the test results, the service life is close to 50000h.

[0052] The general commercially available alumina ceramic stent also has the problem of blackening of the silver-plated layer, and its aging characteristics are comparable to samples made of traditional copper-silver-plated / PCT stents.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a full-spectrum white LED device. A support is an aluminum oxide ceramic support; a glue dispensing area is arranged in the middle of the front surface of the support; a positive electrode and a negative electrode on the front surface of the support are silver, gold or aluminum-plated electrodes; a chip is a near ultraviolet LED chip; the chip is directly fixed on the surface of the glue dispensing area of the support; fluorescent powder is red, yellow and blue three-color fluorescent powder; positive and negative electrodes of the LED chip are connected with the positive and negative electrodes on the front surface of the support in a spot welding mode; and welding spots completely cover the surfaces of the positive and negative electrodes on the front surface ofthe support. The chip is completely covered by the welding spots formed by gold wires or alloy wires after being subjected to wire welding, and low cost of support production is maintained while a blackening effect of a silver-plated layer is eliminated. In an actual test, compared with a traditional copper and silver-plated electrode injection molded support and a general commercially-available large-area silver-plated aluminum oxide ceramic support, the reliability (service life) of a packaging device is improved to be from 1,000 hours to 50,000 hours while the same light effect is guaranteed.

Description

technical field [0001] The invention relates to the technical field of LEDs, in particular to a full-spectrum patch type LED device excited by near ultraviolet or ultraviolet light. Background technique [0002] With the development of the LED industry and the continuous expansion of application fields, especially in recent years, professional lighting fields such as photographic lighting, inspection lighting, and medical lighting have introduced LED light sources, and at the same time, higher requirements have been put forward for the luminous characteristics of LEDs. Among them, the expansion of the LED emission spectrum range has become one of the main improvement directions, and such products are named after full-spectrum LEDs in the industry. At this stage, the main development direction of this type of white LED is to use 380nm-420nm near-ultraviolet chips to excite red, green and blue three-color phosphors. This method compares the luminescence form of the mature blu...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/60H01L33/62H01L33/64
CPCH01L33/486H01L33/60H01L33/62H01L33/641
Inventor 黎力鲁路刘晓东
Owner 北京宇极芯光光电技术有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com