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Copper surface phosphate ester assembly fluid and application thereof

A surface phosphoric acid and assembly liquid technology, applied in the chemical industry, can solve the problems of easy corrosion of copper surface, etc., and achieve the effect of low cost, excellent anti-corrosion effect and easy operation

Active Publication Date: 2019-02-19
SHANGHAI UNIVERSITY OF ELECTRIC POWER
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a copper surface phosphate ester assembly solution and its application in order to overcome the above-mentioned defects in the prior art, prepare a copper surface phosphate ester corrosion inhibiting assembly film, and solve the problem of copper surface in the prior art. Technical problems that are prone to corrosion in corrosive environments

Method used

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  • Copper surface phosphate ester assembly fluid and application thereof
  • Copper surface phosphate ester assembly fluid and application thereof
  • Copper surface phosphate ester assembly fluid and application thereof

Examples

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Effect test

Embodiment 1

[0047] The copper surface phosphate ester assembly solution in this embodiment is triethyl phosphate assembly solution of different concentrations, the solvent is ethanol, and the concentrations of triethyl phosphate are 0.001, 0.005, 0.008, 0.01 mM, 0.02 mM respectively.

[0048] The preparation method of phosphate ester assembly film on copper surface is:

[0049] (1) Grind the 0.5cm×1.0cm copper sheet step by step with 400, 800, 1600 and 2000 mesh metallographic sandpaper, and then polish it with 5μm, 3.5μm, 2.5μm and 1.5μm polishing paste, and use ethanol Decontamination and degreasing treatment, then wash with deionized water, and set aside; (2) Immerse the rinsed copper sheet in triethyl phosphate assembly solution for 1h assembly, the assembly temperature is room temperature, and the surface-to-volume ratio is 20mL / cm 2 , to obtain a phosphate-based assembled film on the copper surface.

[0050] Soak the phosphate ester assembly film on the copper surface in 3wt.% NaCl...

Embodiment 2

[0055] The copper surface phosphate ester assembly solution in this embodiment is triethyl phosphate assembly solution with different concentrations, the solvent is ethanol, and the concentration of triethyl phosphate is 0.01 mM respectively.

[0056] The preparation method of phosphate ester assembly film on copper surface is:

[0057] (1) Grind the 0.5cm×1.0cm copper sheet step by step with 400, 800, 1600 and 2000 mesh metallographic sandpaper, and then polish it with 5μm, 3.5μm, 2.5μm and 1.5μm polishing paste, and use ethanol Decontamination and degreasing treatment, then wash with deionized water, and set aside; (2) Immerse the rinsed copper sheet in triethyl phosphate assembly solution for 1h, the assembly temperature is 35°C, and the surface-to-volume ratio is 50mL / cm 2 , to obtain a phosphate-based assembled film on the copper surface.

Embodiment 3

[0059] The copper surface phosphate ester assembly solution in this embodiment is triethyl phosphate assembly solution with different concentrations, the solvent is ethanol, and the concentration of triethyl phosphate is 0.01 mM respectively.

[0060] The preparation method of phosphate ester assembly film on copper surface is:

[0061] (1) Grind the 0.5cm×1.0cm copper sheet step by step with 400, 800, 1600 and 2000 mesh metallographic sandpaper, and then polish it with 5μm, 3.5μm, 2.5μm and 1.5μm polishing paste, and use ethanol Decontamination and degreasing treatment, then wash with deionized water, and set aside; (2) Immerse the rinsed copper sheet in triethyl phosphate assembly solution for 5 hours, the assembly temperature is 5°C, and the surface-to-volume ratio is 40mL / cm 2 , to obtain a phosphate-based assembled film on the copper surface.

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Abstract

The invention relates to copper surface phosphate ester assembly fluid and application thereof. The assembly fluid comprises triethyl phosphate and a solvent. The concentration of the triethyl phosphate ranges from 0.001 to 0.02 mM, the optimization is 0.01mM, and the solvent is ethyl alcohol. According to the application method, a copper sheet is ground and polished stage by stage through metallograph abrasive paper of 400, 800, 1600 and 2000 and abrasive paste of 5 micrometers, 3.5 micrometers, 2.5 micrometers and 1.5 micrometers, and cleaning is achieved sequentially through absolute ethylalcohol and deionized water; the obtained copper sheet is immersed into the copper surface phosphate ester assembly fluid to be assembly by one hour, and a copper surface phosphate ester assembly filmis obtained. Compared with the prior art, the advantages that the treatment time is short, the method is easy and convenient, operation is easy, the use amount is little, the cost is low, the stability of the assembled film is high, and the body character of metal is not affected are achieved.

Description

technical field [0001] The invention belongs to the field of chemical industry and relates to the anticorrosion technology of metal materials, in particular to a copper surface phosphate ester assembly liquid and its application. Background technique [0002] Copper and its alloys have good electrical conductivity, thermal conductivity, machining and corrosion resistance, and are widely used in many fields such as electronic products, light industry, mechanical equipment manufacturing and marine industry. However, in some corrosive media, such as Cl - In the solution of ions, the long-term operation of these parts will cause serious corrosion and damage, which will greatly reduce the service life, eventually lead to huge economic losses, and bring many adverse effects to production and use. The anti-corrosion method of corrosion inhibitor is simple and the investment in equipment is small. It is a low-cost and effective method. The use of self-assembly technology to prepar...

Claims

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Application Information

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IPC IPC(8): C23F11/167
CPCC23F11/1673
Inventor 张大全施成高立新葛正韬
Owner SHANGHAI UNIVERSITY OF ELECTRIC POWER
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