Back polishing technology for low-cost solar battery
A solar cell and backside polishing technology, which is applied in the direction of circuits, photovoltaic power generation, electrical components, etc., can solve the problems such as the bad influence of the back reflection of the incident light on the battery, achieve a significant passivation effect, increase the output current, and reduce the effect of transmission loss
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Embodiment 1
[0034] A kind of low-cost solar cell back polishing process that this embodiment provides, flow process is as follows figure 1 As shown, it includes the following process: silicon wafer feeding - cleaning silicon wafer surface oil stain - silicon wafer surface texturing and polishing - pure water rinsing - alkali cleaning - second pure water rinsing - pickling - three pure water rinsing - drying ,in:
[0035] T1: Silicon wafer loading, polycrystalline diamond wire cut silicon wafer is selected, and the thickness of the silicon wafer is 180um;
[0036] T2: Etching groove to make texture, place the silicon wafer in the etching groove to control the reaction speed of the upper and lower surfaces of the silicon wafer, so that the reflectance of the textured side of the silicon wafer is 21%-23%, and the non-textured surface on the back of the silicon wafer is polished, the reflectivity Control at 40%-55%;
[0037] The making of the texturing tank solution is specifically: the tex...
Embodiment 2
[0050] A kind of low-cost solar cell back polishing process that this embodiment provides, flow process is as follows figure 1 As shown, it includes the following process: silicon wafer feeding - cleaning silicon wafer surface oil stain - silicon wafer surface texturing and polishing - pure water rinsing - alkali cleaning - second pure water rinsing - pickling - three pure water rinsing - drying ,in:
[0051] T1: Silicon wafer loading, polycrystalline diamond wire cut silicon wafer is selected, and the thickness of the silicon wafer is 180um;
[0052] T2: Etching groove to make texture, place the silicon wafer in the etching groove to control the reaction speed of the upper and lower surfaces of the silicon wafer, so that the reflectivity of the textured side of the silicon wafer is 21%, and the non-textured surface of the silicon wafer is polished, and the reflectivity is controlled at 40%%;
[0053] The making of the texturing tank solution is specifically: the texturing t...
Embodiment 3
[0066] A kind of low-cost solar cell back polishing process that this embodiment provides, flow process is as follows figure 1 As shown, it includes the following process: silicon wafer feeding - cleaning silicon wafer surface oil stain - silicon wafer surface texturing and polishing - pure water rinsing - alkali cleaning - second pure water rinsing - pickling - three pure water rinsing - drying ,in:
[0067] T1: Silicon wafer loading, polycrystalline diamond wire cut silicon wafer is selected, and the thickness of the silicon wafer is 180um;
[0068] T2: Etching groove to make texture, place the silicon wafer in the etching groove to control the reaction speed of the upper and lower surfaces of the silicon wafer, so that the reflectance of the textured side of the silicon wafer is 23%, and the non-textured back of the silicon wafer is polished, and the reflectance is controlled at 55 %;
[0069] The making of the texturing tank solution is specifically: the texturing tank s...
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