Optical coupling system and optical measurement system
A technology of optical measurement system and coupling system, which is applied in the field of optical path coupling system and optical measurement system, can solve the problems of time consumption and affecting the speed of film thickness measurement, and achieve the goals of compressing time, saving cost and improving optical measurement speed Effect
Active Publication Date: 2020-11-27
SEMICON MFG INT TIANJIN +1
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Problems solved by technology
At present, the mainstream film thickness measurement machine on the market is an ellipsometer measurement system based on the principle of ellipsometer. When it is applied to the film thickness measurement of silicon wafers, most of the time is consumed in the translation and alignment of silicon wafers. Seriously affects the speed of film thickness measurement
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[0041] Please refer to figure 1, a film thickness measuring machine based on the principle of ellipsometry, mainly composed of a second light source (which can be a deuterium lamp D2) 101, a first light source (which can be a xenon lamp) 102, a detection light synthesis component (Optical element) 103, and A polarizer (Polarize) 104 , a first focusing unit (Focusing sub-system) 105 , a second focusing unit (collection sub-system) 106 , an analyzer (Analyzer) 107 and a detection unit (Spectrometer) 108 . The first light source 102 and the second light source (D2) 101 produce the detection light beam that irradiates the surface film thickness of the silicon wafer (wafer) 100 to be measured under the action of the detection light synthesis assembly 103; the polarizer 104 changes the detection light beam into polarized light, Wherein when the polarizer 104 is a rotating polarizer, the polarized light generated is elliptically polarized light; the first focusing unit 105 and the co...
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Abstract
The invention provides an optical path coupling system and an optical measurement system. The optical coupling system is mainly composed of a waveguide coupler, a first focusing unit, a second focusing unit and a fiber combiner, and can realize that the incident light from a fixed direction can be irradiated onto different positions of an object surface and the reflected light at different positions of the object surface can be output at the same position. In the optical measurement system, by means of the optical path coupling system, the same detecting light can be irradiated onto a plurality of detecting positions on the surface of the sample to be tested, and the reflected light at the plurality of detecting positions on the surface of the sample to be tested is collected at the same position, so as to avoid the movement and alignment of the sample to be tested, thus greatly improving the optical measurement speed while having no demand for changing the mechanism on the optical path before the waveguide coupler and the mechanism on the optical path after the fiber combiner, so that the optical measurement system can realize the compatibility and modification of the original optical measurement system and save costs.
Description
technical field [0001] The invention relates to the technical field of optical measurement, in particular to an optical path coupling system and an optical measurement system. Background technique [0002] The film thickness measuring machine in the existing wafer foundry is a key machine in the integrated circuit manufacturing process, whether it is measuring the thickness of the photoresist of the lithography machine in the lithography process, or the thickness of the film grown in the film growth process. The thickness of the thin film needs to be tested with a film thickness measuring machine. At present, the mainstream film thickness measurement machine on the market is an ellipsometer measurement system based on the principle of ellipsometer. When it is applied to the film thickness measurement of silicon wafers, most of the time is consumed in the translation and alignment of silicon wafers. Seriously affects the speed of film thickness measurement. Contents of the...
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IPC IPC(8): G02B6/32G02B6/35G01B11/06
CPCG01B11/06G02B6/32G02B6/3518
Inventor 刘玄
Owner SEMICON MFG INT TIANJIN