Reactive epoxy compounds and method for producing the same, core-shell type epoxy resin particles, waterborne epoxy resin composition, and coating composition containing the reactive epoxy compounds

A technology of water-based epoxy resin and epoxy resin particles, which is used in the fields of low-volatile organic compounds, water-based epoxy resin compositions, and reactive surfactants, and can solve the problems of low mechanical stability, poor adhesion, and epoxy resin emulsions. Poor water resistance, etc.

Active Publication Date: 2019-03-01
CHANG CHUN PLASTICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This epoxy resin emulsion suffers from poor water resistance, poor adhesion to substrates or topcoats, and low mechanical stability due to the presence of surfactants

Method used

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  • Reactive epoxy compounds and method for producing the same, core-shell type epoxy resin particles, waterborne epoxy resin composition, and coating composition containing the reactive epoxy compounds
  • Reactive epoxy compounds and method for producing the same, core-shell type epoxy resin particles, waterborne epoxy resin composition, and coating composition containing the reactive epoxy compounds
  • Reactive epoxy compounds and method for producing the same, core-shell type epoxy resin particles, waterborne epoxy resin composition, and coating composition containing the reactive epoxy compounds

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0052] Embodiment 1-synthesis of this reactive epoxy compound (S1)

[0053] 9.6g trimellitic anhydride (TMA) and 200g polyether amine (purchased from HUNTSMAN company, trade name M-2070) were mixed and reacted with 0.04 g of triphenylphosphine (triphenylphosphine, TPP) as a catalyst at 120°C. 18.8g of bisphenol-A epoxy resin (purchased from CCP Company, trade name BE188) and 0.05g of TPP were further added into the reaction, and reacted at 140°C. The final product has the S1 structure as described above with an acid value of 0.77.

Embodiment 2

[0054] Embodiment 2-synthesis of this reactive epoxy compound (S2)

[0055] 24g trimellitic anhydride (TMA) and 250g polyether amine (purchased from HUNTSMAN company, trade name M-2070) were mixed and reacted with 0.05 g of triphenylphosphine (TPP) as a catalyst at 120°C. 94g of bisphenol-A epoxy resin (purchased from CCP Company, trade name BE188) and 0.07g of TPP were further added into the reaction, and reacted at 140°C. The final product has the S2 structure as described above with an acid value of 0.68.

Embodiment 3

[0056] Embodiment 3-synthesis of this reactive epoxy compound (S3)

[0057] 9.6 g of trimellitic anhydride (TMA) and 93.8 g of PEG1500-BE188 were reacted at 120° C. with 0.02 g of triphenylphosphine (TPP) as catalyst. With 100g polyether amine (purchased from HUNTSMAN company, trade name M-2070) was further added to the reaction, and reacted with 0.04 g of triphenylphosphine (TPP) as a catalyst at 120°C. Finally, 18.8g of bisphenol-A epoxy resin (purchased from CCP Company, trade name BE188) and 0.04g of TPP were further added into the reaction, and reacted at 140°C. The final product has the S3 structure as described above and an acid value of 0.94.

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Abstract

This disclosure relates to reactive epoxy compounds that have high water solubility. The reactive epoxy compounds are obtained by mixing an epoxy resin having at least two epoxy groups per molecule with a carboxyl group-containing compound obtained by reacting a polyetheramine comprising a primary amine and an acid anhydride derived from a polyvalent carboxylic acid. This disclosure also relates to waterborne epoxy resin composition comprising core-shell type epoxy resin particles dispersed in a solvent, wherein the particles are formed by an epoxy resin encapsulated in the reactive epoxy compounds of the present invention. The waterborne epoxy resin composition is low in volatile organic compounds.

Description

technical field [0001] The present invention claims priority of U.S. Provisional Patent Application No. US62 / 545,808, filed August 15, 2017, and the entire disclosure of this priority is incorporated herein by reference. [0002] The present invention relates to a reactive epoxy compound, which can also be used as a reactive surfactant. The reactive epoxy compound has high water solubility. The present invention also relates to a water-based epoxy resin composition, which is that an epoxy resin is encapsulated in the reactive epoxy compound to form core-shell type epoxy resin particles and dispersed in a solvent. The epoxy resin composition is low in volatile organic compounds (VOC). By controlling the particle size through molecular design of the reactive epoxy compound, a particle size (ie, particle size) of about 0.7 μm can be produced. When mixed with a curing agent (such as: water-based amine curing agent) and coated on a substrate, the particle size (or surface area) ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G65/00C08L63/00C08L71/00C09D163/00C09D171/00C09D5/08
CPCC08G65/00C08L63/00C08L2201/54C09D5/08C09D163/00C08L71/00C08G59/066C08G59/1455C08G59/1477C08G59/188C08G59/4014C08G2150/90C08L63/04C08L2207/53C09D163/04
Inventor 刘良兴林颖瑞林永升赖一江黄坤源汪奕森
Owner CHANG CHUN PLASTICS CO LTD
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