A composite curing agent, resin composition comprising the composite curing agent, prepreg and laminate
A technology of resin composition and composite curing agent, applied in the field of laminates, can solve the problems of inability to improve flame retardancy and other properties, reduce the time for complete curing of resin, etc., and achieve enhanced curing effect, low solder dip resistance, good The effect of heat resistance
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Embodiment 2
[0080] Comparing Example 2 with Comparative Example 2, it can be seen that because no brominated phenolic compound (tetrabromobisphenol A) is used in the composite curing agent, the flame retardancy of Comparative Example 2 is significantly worse.
Embodiment 3
[0081] Compared with Comparative Example 3, Example 3 has significantly worse solder dipping resistance and heat resistance, and increased water absorption because no phenolic novolak resin is used in the composite curing agent.
Embodiment 4
[0082] Embodiment 4 is compared with comparative example 4, because only a kind of curing agent of brominated phenolic compound (tetrabromobisphenol A) is only used, the solder dipping resistance and heat resistance of comparative example 4 are greatly reduced, and the water absorption rate obviously increases. big.
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