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A composite curing agent, resin composition comprising the composite curing agent, prepreg and laminate

A technology of resin composition and composite curing agent, applied in the field of laminates, can solve the problems of inability to improve flame retardancy and other properties, reduce the time for complete curing of resin, etc., and achieve enhanced curing effect, low solder dip resistance, good The effect of heat resistance

Active Publication Date: 2021-09-17
SHAANXI SHENGYI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The new resin curing agent provided by the present invention has a fast curing reaction rate and can reduce the time for complete resin curing to 4 hours. However, the curing agent can only increase the curing rate of the resin composition, and cannot improve the flame retardancy and other properties.

Method used

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  • A composite curing agent, resin composition comprising the composite curing agent, prepreg and laminate
  • A composite curing agent, resin composition comprising the composite curing agent, prepreg and laminate
  • A composite curing agent, resin composition comprising the composite curing agent, prepreg and laminate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 2

[0080] Comparing Example 2 with Comparative Example 2, it can be seen that because no brominated phenolic compound (tetrabromobisphenol A) is used in the composite curing agent, the flame retardancy of Comparative Example 2 is significantly worse.

Embodiment 3

[0081] Compared with Comparative Example 3, Example 3 has significantly worse solder dipping resistance and heat resistance, and increased water absorption because no phenolic novolak resin is used in the composite curing agent.

Embodiment 4

[0082] Embodiment 4 is compared with comparative example 4, because only a kind of curing agent of brominated phenolic compound (tetrabromobisphenol A) is only used, the solder dipping resistance and heat resistance of comparative example 4 are greatly reduced, and the water absorption rate obviously increases. big.

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PUM

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Abstract

The invention provides a composite curing agent, a resin composition containing the composite curing agent, a prepreg and a laminate, and the composite curing agent includes the following components in weight percentage: 25% to 55% of vegetable oil modified phenolic resin , 25% to 50% of brominated phenolic compounds and 20% to 40% of novolak resins. The composite curing agent of the present invention can enhance the curing effect through the coordination of vegetable oil modified phenolic resin, brominated phenolic compound and novolac resin, and can make the cured product have better machinability and good mechanical properties. Heat resistance, solder dip resistance and low water absorption.

Description

technical field [0001] The invention belongs to the technical field of laminated boards, and relates to a composite curing agent, a resin composition containing the composite curing agent, a prepreg and a laminated board. Background technique [0002] CEM-1 copper-clad laminate is made of electronic grade glass fiber cloth and bleached wood pulp paper, which are respectively impregnated with resin composition for copper-clad laminate to make fabric and core material, and covered with copper foil. Made by hot pressing. Flame retardancy is the primary performance that CEM-1 copper-clad laminates must achieve. However, CEM-1 copper-clad laminates use wood pulp paper as the core material. The wood pulp paper itself is combustible. It is necessary to ensure that CEM- 1. Under the premise of other properties of copper clad laminates, especially heat resistance, toughness, moisture resistance and other properties, it is very difficult to improve the flame retardancy of CEM-1 coppe...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G59/62C08L63/00C08K3/22C08J5/24B32B29/00B32B15/12B32B27/04H05K1/03
CPCB32B15/12B32B29/002B32B2260/028B32B2260/046B32B2307/30B32B2307/3065B32B2307/546B32B2307/726B32B2457/08C08G59/62C08J5/24C08J2363/00C08K3/22C08K2003/2224C08L2201/02C08L2201/08H05K1/0366C08L63/00
Inventor 张龙霍国洋张济明李莎
Owner SHAANXI SHENGYI TECH
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