Device for measuring thermal conductivity of film with steady-state method

A technology of thermal conductivity and steady-state method, which is applied in the field of devices for measuring thermal conductivity of thin films by steady-state method, to achieve the effects of avoiding thermal radiation, simple principle and high degree of automation

Pending Publication Date: 2019-03-08
INST OF METAL RESEARCH - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, when this method is used to test the thermal conductivity of two-dimensional materials, it needs to be designed according to the particularity of the material. At present, there is no commercial computer machine that can be used for these two-dimensional materials.

Method used

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  • Device for measuring thermal conductivity of film with steady-state method
  • Device for measuring thermal conductivity of film with steady-state method
  • Device for measuring thermal conductivity of film with steady-state method

Examples

Experimental program
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Effect test

Embodiment 1

[0038] In the present embodiment, the testing method of testing the thermal conductivity of carbon nano film is as follows:

[0039] Such as Figure 1-Figure 2 As shown, the manufacturing process of the test chip 11 includes: single polishing Si wafer → LPCVD deposition of Si 3 N 4 → Photolithographic deposition of electrodes → photolithographic etching, the size of the photolithographic plate can be modified according to the size of the sample, and then test chips of different sizes can be obtained. Such as image 3 As shown, the central part of the test chip 11 is the sample-carrying area 5 , and the circuit connection area 6 is set on the outside of the test chip 11 . After fabricating the test chip 11 with an electrode spacing of 100 μm, the sample to be tested is transferred to the sample-carrying area 5 on the test chip 11 . Afterwards, the test chip 11 is placed on the sample stage 12 , and the circuit of the test chip 11 is connected to the sample stage 12 at the c...

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PUM

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Abstract

The invention relates to the field of material performance characterization, in particular to a device for measuring thermal conductivity of a film with a steady-state method. The device comprises a sample analysis chamber, a vacuum acquisition system, a temperature control system and a signal monitoring and automatic recording system, wherein a sample is placed on a test chip in the sample analysis chamber, and the sample analysis chamber has a vacuum sealing function; the vacuum acquisition system is connected with the sample analysis chamber to provide a vacuum test environment for the sample; the temperature control system heats, cools or insulates the test chip and provides a variable temperature test environment for the sample; the signal monitoring and automatic recording system isconnected with the temperature control system for automatic temperature setting and recording. In-plane thermal conductivity of a thin film material is accurately measured, and especially when other commercial computers cannot be used for thermal conductivity testing due to too small size or high light transmittance and the like of the sample, thermal conductivity of the sample can be accurately and rapidly obtained by the device.

Description

technical field [0001] The invention relates to the field of material performance characterization, in particular to a device for measuring the thermal conductivity of a thin film using a steady-state method. Background technique [0002] The thermal conductivity of materials is an important physical property, and accompanied by the low-dimensional scale effect of materials, there is a "ballistic" transmission effect that is different from traditional bulk materials, which greatly affects the thermal conductivity and performance of materials. Low-dimensional thermal conductive materials It has far-reaching and important influence in the field of microelectronic system thermal management. [0003] However, due to the strong thermal anisotropy and scale effect of low-dimensional materials, the traditional measurement equipment and principles suitable for measuring the thermal conductivity of bulk materials, such as: the transient laser flashing method is completely inapplicabl...

Claims

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Application Information

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IPC IPC(8): G01N25/20
CPCG01N25/20
Inventor 邰凯平赵洋
Owner INST OF METAL RESEARCH - CHINESE ACAD OF SCI
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