Self-repairing conductive structure and preparation method thereof

Abstract

The invention discloses a self-repairing conductive structure. The structure comprises a conductive layer and a self-repairing layer at least covering one surface of the conductive layer; the self-repairing layer comprises an insulating base body and carbon nanotubes distributed in the insulating base body; the insulating base body has heated flowability; and when the conductive layer has a crack,the self-repairing layer flows into the crack, and the carbon nanotubes in the crack are orderly arranged under the action of an electric field, so that the conductivity of the conductive layer is recovered. According to the self-repairing conductive structure, when the conductive layer has the crack, the self-repairing layer flows into the crack to repair the conductivity of the conductive layer, so that the service life of the conductive structure is prolonged and the phenomenon that a signal of a product applying the conductive structure subsequently is abnormal is avoided. The invention further provides a preparation method of the self-repairing conductive structure.

Description

technical field [0001] The invention relates to a self-repairing conductive structure and a preparation method thereof. Background technique [0002] At present, due to the different ductility and elasticity of the materials in the conductive structure (such as flexible circuit boards), and the thin thickness of the conductive layer, the conductive layer is often cracked under external mechanical or thermal stress. , resulting in the infiltration of water vapor or oxygen, shortening the life of the conductive structure, or causing abnormal signals of subsequent products using the conductive structure. Contents of the invention [0003] The invention provides a self-repairing conductive structure, comprising: [0004] conductive layer; and [0005] The self-healing layer covers at least one surface of the conductive layer. The self-healing layer includes an insulating matrix and carbon nanotubes distributed in the insulating matrix. The insulating matrix has heat flowabil...

AI Technical Summary

Problems solved by technology

[0002] At present, due to the different ductility and elasticity of the materials in the conductive structure (such as flexible circuit boards), and the thin thickness of the conductive layer, the conductive layer is often cracked under external mechanical or thermal stress. , leading to the infiltration of water vapor or oxygen, shortening the life of the conductive structure, or causing abnormal signals of subsequent products using the conductive structure

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