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Polishing pad dresser and manufacturing method thereof

A manufacturing method and dresser technology, which are applied in the directions of manufacturing tools, grinding/polishing equipment, abrasive surface adjustment devices, etc., to achieve the effect of reducing the amount of deformation

Inactive Publication Date: 2019-03-12
YTDIAMOND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The technical problem to be solved by the present invention is to reduce the excessive height difference between multiple cutting tips on the surface of the polishing pad dresser due to the thermal deformation of the base

Method used

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  • Polishing pad dresser and manufacturing method thereof
  • Polishing pad dresser and manufacturing method thereof
  • Polishing pad dresser and manufacturing method thereof

Examples

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Embodiment Construction

[0030] see figure 1 , Figure 2A to Figure 2D . figure 1 It is a flowchart of a manufacturing method of a polishing pad dresser according to one embodiment of the present invention. Figures 2A to 2D The polishing pad dresser of one embodiment of the present invention is respectively in figure 1 Schematic cross-sections of each step.

[0031] Such as figure 1 As shown, in step S100 , a composite base is provided, the composite base includes a base and a buffer solder layer formed on the base, wherein the base has at least one curved surface, and the buffer solder layer covers the curved surface.

[0032] Please refer to Figure 2A and Figure 2B , showing the process of providing the composite base. Specifically, as Figure 2A As shown, a buffer solder 2" is first formed on an initial base 1".

[0033] The material of the initial base 1" can be iron, molybdenum, tungsten, stainless steel, invar or nickel-based superalloy. In one embodiment, the material of the initial...

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Abstract

The invention discloses a polishing pad dresser and a manufacturing method thereof. The manufacturing method of the polishing pad dresser at least comprises the steps that a compound base is provided,and the compound base comprises a base seat and at least one layer of buffer solder layer, wherein at least a heat curing process is included in the step of providing the compound base to form the buffer solder layers and the base seat. Before the step of forming a grinding portion on the compound base, a flattening step is executed first to form a flat surface on one side of the compound base. The grinding portion is formed on the flat surface, and in this way, the problem that the height difference between a plurality of tips of the grinding portion is excessive due to thermal deformation of the base seat is solved.

Description

technical field [0001] The invention relates to a polishing pad dresser used in chemical mechanical polishing process and its manufacturing method, in particular to a polishing pad dresser suitable for dressing polishing pads and its manufacturing method. Background technique [0002] Chemical mechanical polishing is one of the most commonly used methods to planarize the surface of semiconductor wafers. In the chemical mechanical polishing process, a polishing pad is usually used together with a polishing liquid to polish the surface of the semiconductor wafer. In the chemical mechanical polishing process, the polishing pad dressing device is used to dress the surface of the polishing pad, remove the waste generated when polishing the wafer, and restore the roughness of the polishing pad to maintain the stability of the polishing quality. [0003] The existing polishing pad conditioning device generally includes a substrate and a diamond grinding layer disposed on one side ...

Claims

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Application Information

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IPC IPC(8): B24B53/017B24B53/12
CPCB24B53/017B24B53/12
Inventor 陈盈同
Owner YTDIAMOND
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