Zero-release treatment process of electroplating wastewater

A technology for treating process and electroplating wastewater, applied in metallurgical wastewater treatment, water/sewage treatment, water/sewage multi-stage treatment, etc., can solve problems such as high energy consumption, cost increase, and inhibition of enterprise survival and development. Reach the effect of reducing the amount of waste water, reducing energy consumption and reducing the overall cost

Active Publication Date: 2019-03-26
SHANGHAI RADIALL ELECTRONICS
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

With the introduction of the concept of "zero emission", more and more enterprises are trying to achieve "zero emission". develop

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  • Zero-release treatment process of electroplating wastewater

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Embodiment Construction

[0055] The implementation of the present invention will be illustrated by specific specific examples below, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification.

[0056] It should be noted that the structures, proportions, sizes, etc. shown in the drawings attached to this specification are only used to match the content disclosed in the specification, for those who are familiar with this technology to understand and read, and are not used to limit the implementation of the present invention. Limiting conditions, so there is no technical substantive meaning, any modification of structure, change of proportional relationship or adjustment of size, without affecting the effect and purpose of the present invention, should still fall within the scope of the present invention. within the scope covered by the disclosed technical content. At the same time, terms such as "upper", "lo...

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Abstract

The invention provides a zero-release treatment process of electroplating wastewater. The zero-release treatment process comprises the following steps of S1, collecting the wastewater in a classification manner; S2, enabling the wastewater, which is subjected to cyanide breakage, in a high-concentration cyanide wastewater collecting pool to flow into a high-concentration neutralizing tank togetherwith the wastewater in a high-concentration acid-alkali wastewater collecting pool, and generating a deposit; S3, discharging sludge from the wastewater in the high-concentration neutralizing tank through deposition, and flowing into a low-concentration cyanide breaking tank together with the wastewater in a low-concentration cyanide wastewater collecting pool; S4, enabling the wastewater in thelow-concentration cyanide breaking tank and the wastewater in a low-concentration acid-alkali wastewater collecting pool to flow into a low-concentration neutralizing tank, and generating a deposit; S5, discharging sludge from the low-concentration neutralizing tank through the deposition; S6, filtering the wastewater in a temporary storage tank and then flowing into a PH (Potential of Hydrogen) regulating pool; and S7, enabling wastewater in the PH regulating pool to pass through a metal ion adsorption system and a reverse osmosis membrane system in sequence to form reverse osmosis water andconcentrated water. The wastewater reuse rate of the zero-release treatment process can be up to 95% or above; and moreover, the zero-release treatment process can be used for saving water, conservingenergy and protecting an environment.

Description

technical field [0001] The invention belongs to the technical field of electroplating wastewater treatment, in particular to a zero-discharge treatment process of electroplating wastewater. Background technique [0002] Electroplating is the process of plating one or more layers of other metals or alloys on some metal surfaces by electrochemical methods, so as to prevent metal oxidation, improve wear resistance, electrical conductivity, corrosion resistance and enhance aesthetics. . [0003] In the electroplating process, in order to ensure a good bonding force between the electroplated metal layer and the substrate and a smooth and good appearance of the metal coating, the oxide layer and oil stains on the surface of the substrate before electroplating should be thoroughly cleaned; during the electroplating process, each The cleaning of the plating solution attached between the metal plating layers of the first layer, post-treatment passivation and filming and other proces...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C02F9/10C02F101/18C02F103/16
CPCC02F9/00C02F1/66C02F1/5236C02F1/444C02F1/441C02F2101/18C02F2103/16C02F2001/007C02F2001/422C02F2001/425C02F1/42C02F1/001C02F1/04Y02P10/20
Inventor 范安平金妤黄瑜
Owner SHANGHAI RADIALL ELECTRONICS
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