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Preparation method of curing agent for phenolic foam resin

A technology of phenolic foam resin and curing agent, which is applied in the field of polymer application chemistry, can solve the problems of low price of inorganic acid, fast curing speed, metal corrosion, etc., and achieve the effect of uniform texture, good heat preservation performance and small pore size

Inactive Publication Date: 2019-03-26
SHANDONG LAIWU RUNDA NEW MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The price of inorganic acid is low, but the curing speed is too fast, which has a strong corrosion effect on metals, so anticorrosion has become a major problem in the use of phenolic foam

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] Weigh 100 parts of concentrated sulfuric acid by weight and add it to the reaction kettle, start the agitator, add 40 parts of urea in 2 times, and add 50 parts of water and 10 parts of polyethylene glycol 200 at a temperature of 50°C, and stir evenly to obtain Curing agent for phenolic foam resin.

[0027] Take by weight 50 parts of the above-mentioned phenolic foam resin made by curing agent, 4 parts of Tween 80, 100 parts of phenolic foam resin, 8 parts of blowing agent, production density is 50kg / m 3 According to the GB / T10294-2008 standard, the thermal conductivity of the phenolic foam board is 0.024W / (m·K).

Embodiment 2

[0029] Weigh 100 parts of concentrated sulfuric acid by weight and add it to the reaction kettle, start the agitator, add 45 parts of urea in 3 times, add 45 parts of water and 15 parts of polyethylene glycol 400 at a temperature of 55°C, and stir evenly to obtain phenolic foam Curing agent for resin.

[0030] Take by weight 50 parts of curing agent for phenolic foam resin, 4 parts of Tween 80, 100 parts of phenolic foam resin, and 8 parts of blowing agent, and the production density is 50kg / m 3 According to the GB / T10294-2008 standard, the thermal conductivity of the phenolic foam board is 0.023W / (m·K).

Embodiment 3

[0032] Weigh 100 parts of concentrated sulfuric acid by weight and add it to the reaction kettle, start the agitator, add 50 parts of urea in 4 times, add 40 parts of water and 20 parts of propylene glycol at a temperature of 60°C, and stir evenly to obtain a curing agent for phenolic foam resin .

[0033] Take by weight 50 parts of curing agent for phenolic foam resin, 4 parts of Tween 80, 100 parts of phenolic foam resin, and 8 parts of blowing agent, and the production density is 50kg / m 3 According to the GB / T10294-2008 standard, the thermal conductivity of the phenolic foam board is 0.024W / (m·K).

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Abstract

The invention belongs to the field of high polymer application chemistry and particularly relates to a preparation method of a curing agent for phenolic foam resin. The preparation method is characterized by comprising the steps of: adding urea to concentrated sulfuric acid, carrying out heating reaction, adding water and an auxiliary agent and stirring to obtain the curing agent for the phenolicfoaming resin. A phenolic foam board produced by using the curing agent prepared by adopting the preparation method is uniform in texture, small in pore size, low in thermal conductivity coefficient and good in heat preservation performance; and the production cost of the curing agent is lower than that of the same amount of a p-toluenesulfonic acid, phosphoric acid and sulfuric acid mixture.

Description

technical field [0001] The invention belongs to the field of polymer applied chemistry, and in particular relates to a preparation method of a curing agent for phenolic foam resin. Background technique [0002] Phenolic foam is a kind of foam obtained by foaming phenolic resin. It is called the third generation of emerging insulation materials. Compared with the early market-dominated polystyrene foam, polyvinyl chloride foam, polyurethane foam and other materials , phenolic foam is light in weight, high rigidity, good dimensional stability, has special excellent performance in flame retardancy, chemical corrosion resistance, good heat resistance, flame retardant, self-extinguishing, low smoke, flame penetration resistance, fire resistance No spills and low price, it is an ideal insulation and heat insulation material for electrical appliances, instrumentation, construction, petrochemical and other industries, so it has been widely valued by people. At present, phenolic foa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L61/06C08L71/02C08K5/21C08K3/30C08K5/06C08K5/053
CPCC08K3/30C08K5/053C08K5/06C08K5/21C08L61/06C08L71/02
Inventor 李长彬郑超吕虎刘常玉亓玉健韩京涛刘卫国
Owner SHANDONG LAIWU RUNDA NEW MATERIAL
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