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A photosensitive resin composition

A technology of photosensitive resin and composition, applied in the field of photosensitive resin composition, can solve problems such as insufficient heat resistance of heat-resistant solder, achieve excellent flexibility, improve solder heat resistance, and reliable heat resistance. Effect

Inactive Publication Date: 2019-03-29
TAMURA KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, in Patent Document 1 in which a compound having a urethane bond is blended in order to impart flexibility, there is a problem that the heat resistance of the photocured film, especially the solder heat resistance at a high temperature of 350° C. or higher, may not be sufficient. full

Method used

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  • A photosensitive resin composition
  • A photosensitive resin composition

Examples

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Comparison scheme
Effect test

Embodiment 1～5、 comparative example 1～6

[0076]Mix the ingredients shown in the following Tables 1 and 2 in the mixing ratios shown in the following Tables 1 and 2, and mix and disperse them at room temperature using triple rollers to prepare the compounds in Examples 1 to 5 and Comparative Examples 1 to 6. The photosensitive resin composition used. Unless otherwise specified, the compounding quantity of each component described in following Table 1, 2 shows a mass part. In addition, the blank part of the compounding quantity in following Table 1, 2 shows not compounding.

[0077] [Table 1]

[0078]

[0079] [Table 2]

[0080]

[0081] Details about each component in Tables 1 and 2 are as follows.

[0082] (A) Photosensitive resin containing carboxyl group

[0083] ・SP-4621: Solid content (resin content) 65% by mass, Showa High Polymer Co., Ltd.

[0084] ・ZAR-2000, ZCR-1569H, FLX-2089: solid content (resin content) are all 65% by mass, Nippon Kayaku Co., Ltd.

[0085] It should be noted that SP-4621, ZAR-...

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Abstract

An object of the present invention is to provide a photosensitive resin composition which can obtain a cured product excellent in flexibility and heat resistance, particularly in solder heat resistance at a high temperature of 350 DEG C or higher. The photosensitive resin composition contains (A) a carboxyl group-containing photosensitive resin, (B) a reactive diluent, (C) a photopolymerization initiator, and (D) an epoxy compound, wherein the (A) contains the carboxyl group-containing photosensitive resin having a urethane bond contained in the photosensitive resin of a carboxyl group is 10%by mass or less, the (B) reactive diluent contains a caprolactone-modified (meth)acrylate, and it is a compound which does not have a urethane bond.

Description

technical field [0001] The present invention relates to a photosensitive resin composition capable of obtaining a cured product excellent in flexibility and heat resistance. Background technique [0002] A printed circuit board is used to form a pattern of a conductive circuit on a substrate and to mount electronic components on the pads of the pattern by soldering, and the circuit portion other than the soldering pads may be covered with an insulating film that is a photocuring film . Thereby, when soldering an electronic component to a printed circuit board, solder is prevented from adhering to unnecessary parts, and circuit conductors are prevented from being directly exposed to air and being corroded by oxidation or humidity. [0003] The printed circuit board includes a printed circuit board using a rigid substrate, a printed circuit board using a flexible substrate, and the like. In particular, in printed circuit boards (flexible printed circuit boards) using flexibl...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/004G03F7/027
CPCG03F7/004G03F7/027C08F20/26C08G59/42H05K1/0313
Inventor 前川浩二斋藤隆英轻部彰彦土屋雅裕
Owner TAMURA KK
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