Thick-copper copper substrate etching process

Abstract

The invention discloses a thick-copper copper substrate etching process. The thick-copper copper substrate etching process comprises the following steps of: (1) cutting; (2) plate grinding: grinding athick-copper copper substrate to properly improve the roughness of a surface of the thick-copper copper substrate, and cleaning the substrate surface; (3) pad pasting: attaching anti-corrosion ink ora dry film to substrate surface of the thick-copper copper substrate; (4) exposure; (5) development; (6) etching: employing acidic etching medicinal liquid to perform redox reaction with the exposedthick-copper copper substrate to etch the corrosion of the thick-copper copper substrate at the through hole so as to obtain accurate through holes with various shapes; and (7) film removing. The anti-corrosion ink or the dry film is attached to the thick-copper copper substrate, various required through hole graphs are preset on the anti-corrosion ink or the dry film, an etching copper removal mode is employed to achieve processing of the through holes with various shapes to replace a traditional machining mode of drilling and drill-in and drill-out so as to greatly reduce the processing costand improve the production efficiency and the production quality.

Description

technical field [0001] The invention relates to the technology in the field of PCB production, in particular to a thick copper-copper substrate pitting process. Background technique [0002] In the production process of PCB boards, it is often necessary to open holes on thick copper and copper substrates. At present, the circular through-holes are processed on thick copper-copper substrates, and the method adopted is to use a drill + drill to drill out. This kind of process costs too much and causes a waste of resources. At the same time, the thicker the copper substrate, the worse the accuracy. If it is necessary to process special-shaped through-holes on thick copper-copper substrates, it is more difficult to use the drill + drill bit, and the hole type and hole position accuracy cannot be guaranteed. Therefore, it is necessary to study a scheme to solve the above problems. Contents of the invention [0003] In view of this, the present invention aims at the deficienc...

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Problems solved by technology

[0003] In view of this, the present invention aims at the deficiencies in the prior art, and its main purpose is to provide a thick copper-copper substrate etching process, which can effectively solve the problem of high cost, poor precision and inability to process holes in the existing thick copper-copper substrate. Problems in processing special-shaped through holes

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