Thick-copper copper substrate etching process

A copper substrate and process technology, applied in the field of PCB production, can solve the problems of poor precision, high hole processing cost, and inability to process special-shaped through holes, etc., to achieve the effect of reducing processing cost, improving production efficiency and production quality

Inactive Publication Date: 2019-04-05
东莞市若美电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
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Problems solved by technology

[0003] In view of this, the present invention aims at the deficiencies in the prior art, and its main purpose is to provide a thick copper-copper substrate etching process, which can eff

Method used

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  • Thick-copper copper substrate etching process
  • Thick-copper copper substrate etching process
  • Thick-copper copper substrate etching process

Examples

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[0024] The invention discloses a hole etching process for a thick copper copper substrate, which includes the following steps:

[0025] (1) Cutting material: cut thick copper copper substrate 10 size according to product requirements.

[0026] (2) Polishing: the thick copper-copper substrate 10 is polished to appropriately improve the surface roughness of the thick copper-copper substrate 10 while cleaning the surface. In this embodiment, in the process of grinding the plate, the size of the wear scar is controlled to be 12-16 mm, the mass concentration of pozzolan is 15-25%, the temperature is controlled at 80-90°C, and the speed is controlled at 2.0-2.5 m / min.

[0027] (3) Film sticking: stick anti-corrosive ink or dry film 20 on the surface of the thick copper copper substrate 10. In this embodiment, the film sticking is performed in an environment with a temperature of 110-130°C, and the speed is controlled at 1.2-1.4 m / min.

[0028] (4) Exposure: The through-hole image film 30 i...

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Abstract

The invention discloses a thick-copper copper substrate etching process. The thick-copper copper substrate etching process comprises the following steps of: (1) cutting; (2) plate grinding: grinding athick-copper copper substrate to properly improve the roughness of a surface of the thick-copper copper substrate, and cleaning the substrate surface; (3) pad pasting: attaching anti-corrosion ink ora dry film to substrate surface of the thick-copper copper substrate; (4) exposure; (5) development; (6) etching: employing acidic etching medicinal liquid to perform redox reaction with the exposedthick-copper copper substrate to etch the corrosion of the thick-copper copper substrate at the through hole so as to obtain accurate through holes with various shapes; and (7) film removing. The anti-corrosion ink or the dry film is attached to the thick-copper copper substrate, various required through hole graphs are preset on the anti-corrosion ink or the dry film, an etching copper removal mode is employed to achieve processing of the through holes with various shapes to replace a traditional machining mode of drilling and drill-in and drill-out so as to greatly reduce the processing costand improve the production efficiency and the production quality.

Description

technical field [0001] The invention relates to the technology in the field of PCB production, in particular to a thick copper-copper substrate pitting process. Background technique [0002] In the production process of PCB boards, it is often necessary to open holes on thick copper and copper substrates. At present, the circular through-holes are processed on thick copper-copper substrates, and the method adopted is to use a drill + drill to drill out. This kind of process costs too much and causes a waste of resources. At the same time, the thicker the copper substrate, the worse the accuracy. If it is necessary to process special-shaped through-holes on thick copper-copper substrates, it is more difficult to use the drill + drill bit, and the hole type and hole position accuracy cannot be guaranteed. Therefore, it is necessary to study a scheme to solve the above problems. Contents of the invention [0003] In view of this, the present invention aims at the deficienc...

Claims

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Application Information

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IPC IPC(8): H05K3/00H05K3/06
CPCH05K3/0088H05K3/06H05K2203/03
Inventor 洪少鸿
Owner 东莞市若美电子科技有限公司
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