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A solder paste printing performance influence factor analysis method based on SMT big data

A technology of solder paste printing and influencing factors, which is applied in the field of analysis of influencing factors of solder paste printing performance based on SMT big data, can solve problems such as surface mount product quality problems, unsuitable test design factor level selection, and affecting enterprise benefits, etc. Achieve the effect of ensuring model output results, good model output results, and improving printing quality

Active Publication Date: 2019-04-09
无锡启工数据科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

According to analysis, about 70% of the quality problems of SMT products are caused by poor solder paste printing performance
[0003] The solder paste printing operation of printed circuit boards in surface mount technology is complicated, and the equipment, materials and personnel involved are difficult to control. Any link in the printing process may cause quality problems of surface mount products due to improper control, resulting in products that cannot be printed. Passing the test will cause waste of resources and affect the efficiency of the enterprise
[0004] In the current surface mount technology, the solder paste printing mainly has the following problems: ①The solder paste printing process is complicated, the printing parameters are various, and the parameters affect each other, and there is an interactive relationship
However, the disadvantage of this method is that the range of influencing factors is limited to the level combination of experimental factors, and in actual production, some parameter ranges are continuous, which is not suitable for the selection of factor levels in experimental design.
However, the cost of the analysis method of the influencing factors of the experimental design is too high, and this method is not suitable for the selection of printing parameter levels with continuous value intervals
The existing methods for analyzing factors affecting solder paste performance combined with data mining focus on fitting the relational expressions between solder paste performance indicators and printing parameters, but the relational expressions are relatively simple and rely on subjective experience, making it difficult to describe printing parameters objectively and accurately Relationship with solder paste performance index
In addition, there are two types of printing parameters of solder paste: numerical type and category type. The processing of the two types of printing parameters is not considered in the model, the analysis is not comprehensive enough, and the analysis results cannot accurately reflect the key influencing factors

Method used

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  • A solder paste printing performance influence factor analysis method based on SMT big data
  • A solder paste printing performance influence factor analysis method based on SMT big data
  • A solder paste printing performance influence factor analysis method based on SMT big data

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Embodiment 1

[0031] At present, the methods for analyzing the influencing factors of solder paste printing performance mainly include production experience, experimental design, statistical methods and data mining. Most of them select a range of influencing factors based on experience, and then conduct quantitative analysis to judge their degree of influence and interaction. The analysis method used is costly and time-consuming. At the same time, the data mining method using fitting relational expressions is too subjective, and it is difficult to objectively and accurately reflect the complex relationship between solder paste printing performance indicators and printing parameters. At the same time, it is difficult for existing models to simultaneously Incorporating numerical and categorical printing parameter characteristics into the analysis process of influencing factors, some important parameters that affect the printing performance of solder paste are omitted.

[0032]The present inve...

Embodiment 2

[0043] The analysis method of influencing factors of solder paste printing performance based on SMT big data is the same as embodiment 1, and the outlier detection based on the Mahalanobis distance between data samples described in step (2) of the present invention is by calculating the Mahalanobis distance between data sample points To test the proximity between samples, its advantage over Euclidean distance is that Mahalanobis distance will consider the shape of the distribution instead of just calculating the distance from the point to the center of the distribution. For example, for the data attribute of an elliptical distribution, although the point near the short side is closer to the center of the distribution, it may deviate more from the overall distribution shape area.

[0044] For the row vectors x and y composed of two different data samples in the solder paste printing data set X, the Mahalanobis distance is calculated as follows:

[0045]

[0046] where d repr...

Embodiment 3

[0052] The analysis method of influencing factors of solder paste printing performance based on SMT big data is the same as that of Embodiment 1-2, and the correlation between the calculation factors described in step (3) of the present invention includes three ways: numerical and numerical printing parameter characteristics The calculation of the correlation between the numerical and category printing parameter features and the Clem correlation coefficient calculation between the category printing parameter features. There are different calculation methods for different attribute correlation calculations. The specific calculations are as follows:

[0053] (3.1) Calculate the correlation coefficient

[0054] The correlation coefficient can be used to measure the degree of correlation between numerical data attributes. For two printing parameter features x and y, the calculation formula of the correlation coefficient is as follows:

[0055]

[0056] Among them, r x,y Indica...

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Abstract

The invention provides a solder paste printing performance influence factor analysis method based on SMT big data, and solves the problems of incomplete analysis and low precision in solder paste printing performance influence factor analysis. The method comprises the following implementation steps: collecting solder paste printing parameters and performance indexes to construct a solder paste printing data set; Processing the data by using a Mahalanobis distance and a null value; Calculating correlation coefficients among the features, and filtering redundant features; Dividing training and testing sample sets; Randomly extracting a part of features and constructing a random forest model; Setting a model termination condition; Estimating a characteristic importance degree score accordingto the model mean square error increment, and performing sorting; and determining a subset of key impact factors. According to the method, the key influence factors of the SMT solder paste printing performance are mined through random forest feature selection in combination with the big data processing technology, the correlation between the performance indexes and the printing parameters is determined, the solder paste printing performance is optimized, and the circuit board printing quality is improved. The method is used for process optimization and solder paste printing performance improvement in the surface mounting technology solder paste printing process.

Description

technical field [0001] The invention belongs to the field of surface mount technology (SMT), and mainly relates to the analysis and excavation of solder paste printing performance in a surface mount production line, specifically a method for analyzing factors affecting solder paste printing performance based on SMT big data, which is applied to circuits Improve the solder paste printing performance of the board and provide a reference for its process optimization. Background technique [0002] With the development of the economy, the market has higher and higher requirements for electronic products. Mounted devices are becoming flatter and miniaturized. Mounting technology puts forward higher requirements. Surface mount technology mainly includes three main processes: solder paste printing, component placement and reflow soldering. Among them, solder paste printing is the first step and the most critical step. According to analysis, about 70% of the quality problems of SMT...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F17/18G06K9/62
CPCG06F17/18G06F18/24323
Inventor 常建涛孔宪光王佩刘瑄璞
Owner 无锡启工数据科技有限公司
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