Method for applying oxidized PE wax to sealing protection of circuit board

A circuit board, oxidized polyethylene wax technology, applied in the directions of printed circuit parts, adhesive additives, polymer adhesive additives, etc., to achieve the effects of good acid and alkali resistance, simple sealing method, and easy promotion

Active Publication Date: 2019-04-16
康威通信技术股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] But the low temperature anti-crack performance of above-mentioned protective wax composition still needs to be further improved

Method used

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  • Method for applying oxidized PE wax to sealing protection of circuit board
  • Method for applying oxidized PE wax to sealing protection of circuit board
  • Method for applying oxidized PE wax to sealing protection of circuit board

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Experimental program
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Embodiment 1

[0045] The basic composition of the composite wax liquid is shown in Table 1:

[0046] Table 1

[0047]

[0048]

[0049] Oxidized PE wax: make full use of its hydrophobicity and chemical stability, and form a layer of PVC film on the surface after heating and curing, which has excellent waterproof, moisture-proof and mildew-proof performance.

[0050] Tackifier: Make full use of its adhesive properties to increase the adhesion of the main material oxidized PE wax to circuit boards and components.

[0051] Toughening agent: make full use of its excellent toughness at low temperature to solve the problem that the wax film of oxidized PE wax is easy to crack during low temperature and thermal expansion and contraction.

[0052] The process flow of circuit board waterproof treatment is as follows:

[0053] There are three important links in the whole waterproof treatment process, namely circuit board pretreatment, dip coating and cooling.

[0054] The first step of pretr...

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Abstract

The invention relates to a method for applying oxidized PE wax to sealing protection of a circuit board. The method comprises the steps that the surface of the circuit board is coated with a layer ofcoupling agent, and air drying is conducted; the circuit board is dehumidified; a tackifier and a liquid toughening agent are added into the molten oxidized polyethylene wax to be uniformly mixed to prepare molten wax; the dehumidified circuit board is immersed in the molten wax for sealing, and after sealing is completed, the circuit board is placed on release paper and dried. By means of the sealing method, the defects that the oxidized PE wax easily cracks at the low temperature and has poor adhesion force are overcome; the tackifier and the toughening agent is added according to a ratio through repeated experiments, and finally, the oxidized PE wax can meet the requirement of the circuit board for effective waterproof and moisture-proof sealing in the working environment at minus 20-60DEG C. By means of the method, the good acid and alkali resistance, electrolytic-resistance chemical stability and hydrophobicity of the main ingredient PE wax are fully utilized, and a layer of waxfilm is formed on the surface of the circuit board and a component to protect the circuit board after melting.

Description

technical field [0001] The invention belongs to a method for sealing and protecting circuit boards, and in particular relates to applying oxidized PE wax to waterproof and moisture-proof sealing protection of circuit boards, which can effectively realize the normal operation of circuit boards in long-term underwater, humid and hot environments. Background technique [0002] At present, the sealing protection method of circuit boards working in underwater, humid, and hot environments mainly uses three anti-paints combined with potting glue to completely cover and seal the circuit boards with a relatively high thickness. This method involves relatively long colloid curing time, circuit board size consumption and high cost of potting glue, and subsequent maintenance needs to buckle the glue and dissolve the colloid. It consumes man-hours, and it is easy to damage electronic components, which is not conducive to the recovery of failure phenomena. analyze. In order to achieve hi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J123/30C09J11/08H05K1/02
CPCC09J11/08C09J123/30H05K1/02C08L23/12
Inventor 王军杨震威张明广
Owner 康威通信技术股份有限公司
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