A highly reliable double-sided heterogeneous composite electrode thermal chip
A composite electrode and bottom electrode technology, applied in thermistors, non-adjustable metal resistors, circuits, etc., can solve problems such as product failure, reliability decline, and sudden change in chip electrical performance, to improve stability and reliability. sexual effect
Active Publication Date: 2021-06-08
ZHAOQING EXSENSE ELECTRONICS TECH
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Problems solved by technology
[0007] However, the existing thermistor chips have the following problems in the bonding process and actual use of solder paste reflow soldering: the silver surface electrodes are suitable for bonding with aluminum wires, copper wires or gold wires, and the soldering The effect is good, but when the silver bottom electrode is welded on the circuit board by solder paste reflow soldering technology, there is a silver eating phenomenon (ie, silver migration). A slight silver eating phenomenon will cause a sudden change in the electrical performance of the chip and a decrease in reliability. In severe cases, there is no silver attached to the bottom of the chip, which exposes the ceramic body and causes the chip to separate from the circuit board after soldering, which directly leads to product failure. In addition, when silver and tin are welded together, a tin-silver alloy will be formed, which will lead to poor electrode performance of the chip. Change
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[0033] see figure 2 , which is a schematic structural view of the highly reliable double-sided heterogeneous compound electrode thermosensitive chip of the present invention.
[0034] The high-reliability double-sided heterogeneous composite electrode thermosensitive chip of the present invention includes a thermosensitive ceramic substrate 1, a surface electrode 2 and a bottom electrode 3, and the surface electrode 2 and the bottom electrode 3 are respectively arranged on the thermosensitive ceramic substrate 1 The surface electrode 2 is a silver layer, and the bottom electrode 3 is formed by stacking a titanium-tungsten layer 31 , a copper layer 32 and a gold layer 33 sequentially on the heat-sensitive ceramic substrate 1 from inside to outside.
[0035] Specifically, in the bottom electrode 3 , the thickness of the titanium-tungsten layer 31 is 0.1-0.15 microns, the thickness of the copper layer 32 is 0.1-0.2 microns, and the thickness of the gold layer 33 is 0.25-0.55 mic...
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Abstract
The invention relates to a high-reliability double-sided heterogeneous composite electrode thermosensitive chip. The thermistor chip includes a thermosensitive ceramic substrate, a surface electrode and a bottom electrode, and the surface electrode and the bottom electrode are respectively arranged on the thermosensitive On both surfaces of the ceramic substrate, the surface electrode is a silver layer, and the bottom electrode is formed by stacking a titanium-tungsten layer, a copper layer and a gold layer sequentially on the heat-sensitive ceramic substrate from inside to outside. The invention also relates to a preparation method of the high-reliability double-sided heterogeneous composite electrode thermosensitive chip. The high-reliability double-sided heterogeneous compound electrode thermosensitive chip described in the present invention can meet the two welding processes of reflow soldering and wire bonding at the same time, and has the advantages of good bonding effect, high temperature resistance, high reliability and high stability .
Description
technical field [0001] The invention relates to the technical field of electronic components, in particular to a highly reliable double-sided heterogeneous composite electrode thermosensitive chip and a preparation method thereof. Background technique [0002] Thermistor chips are widely used in various temperature detection, temperature compensation, and temperature control circuits. They play a central role in converting temperature variables into required electronic signals in the circuit. [0003] Such as figure 1 As shown, the existing thermistor chip includes a thermosensitive ceramic substrate 1', a surface electrode 2' and a bottom electrode 3', and the surface electrode 2' and the bottom electrode 3' are respectively arranged on the thermosensitive ceramic substrate On both surfaces of 1', the surface electrode 2' and the bottom electrode 3' are made of the same metal, for example both are made of silver or both are made of gold. Since the thermosensitive ceramic ...
Claims
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IPC IPC(8): H01C1/142H01C1/144H01C7/00
CPCH01C1/142H01C1/144H01C7/008
Inventor 柏小海段兆祥杨俊唐黎民柏琪星
Owner ZHAOQING EXSENSE ELECTRONICS TECH