Manufacturing method of semiconductor device and semiconductor device

Abstract

The present invention provides a manufacturing method of a semiconductor device and a semiconductor device. The method comprises the steps of: providing a semiconductor wafer on which a dummy aluminumpad is formed; and forming a fluorine-absorbing layer on the dummy aluminum pad. According to the manufacturing method of the semiconductor device, a dummy aluminum pad is formed on a semiconductor wafer, a fluorine-absorbing layer is formed on the dummy aluminum pad, the fluorine-absorbing layer on the dummy aluminum pad can be used as a cleaning point to uniformly absorb the residual fluorine to avoid the reaction of the residual fluorine and the chip aluminum pad so as to avoid generation of crystallization on the chip aluminum pad. The manufacturing method of the semiconductor device andthe semiconductor device can greatly improve the corrosion resistance and storage conditions of the wafer, can effectively reduce the probability of defects on the surface of the wafer, can avoid wafer scrapping, and can improve the usage performance of the product in the packaging process.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a method for manufacturing a semiconductor device and the semiconductor device. Background technique [0002] The package of the semiconductor chip is connected to external components of the chip package through contact pads formed on the chip for electrical conduction. At present, aluminum pads (Al pads) are mostly used as contact pads in the semiconductor field. [0003] During the semiconductor process, as the wafer semiconductor process proceeds, before the wafer is packaged and cut into chips, aluminum pads often have crystal defects formed on their surface. As time goes on, the phenomenon of crystallization becomes more serious, and these crystallizations often affect the progress of the subsequent packaging process, and more seriously cause the wafer to be scrapped. In order to avoid the impact of crystallization on wafer quality, it often takes a lot of manpow...

AI Technical Summary

Problems solved by technology

With the prolongation of time, the phenomenon of crystallization becomes more serious, and these crystallizations often affect the subsequent packaging process, and more seriously cause wafer scrapping

In order to avoid the impact of crystallization on wafer quality, it often takes a lot of manpower and material resources to carry out repeated inspections

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