Broadband electromagnetic wave absorption super material based on fusion of foam medium-based material and metal structure
A metal structure and base material technology, applied in electrical components, antennas, etc., can solve the problems of high density, poor electromagnetic wave absorption effect, and large thickness, and achieve the effect of simple structure and favorable engineering application.
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Embodiment 1
[0036] The selected base material is carbon foam. A foam board with a mesh diameter of 1mm, an electrical conductivity of 0.7s / m-1s / m, 200×200mm, and a thickness of 20mm is processed into a 20×20×10mm square foam material; the square foam material is made of polyimide with a thickness of 2μm Wrap the film, glue the foam block on the 0.5mm thick FR4 dielectric bottom plate with epoxy resin, and put the foam block at a distance of 2mm, and put it into the mold. Mix phenolic resin with a weight ratio of 88:2:10, p-toluenesulfonic acid, and hollow glass microspheres with a particle size of 10-50 μm, fill the mixture in the gaps between the foams, and form the mixture with the above foam combination in the mold Completion of hot-press lamination, the lamination conditions are temperature control at 90°C, application of pressure at 9MPa, and keeping for 3 hours. The square metal ring is covered on the FR4 dielectric substrate. The thickness of the square metal ring structure is 30 ...
Embodiment 2
[0039] The selected base material is silicon carbide foam. Choose mesh aperture 4mm, resistivity 10 3 -10 10 Ω·m, 200×200mm foam board, thickness 20mm; processed into 50×50×15mm square foam material; wrap the square foam material with polyimide film with thickness 3μm, and glue the foam block with epoxy resin A 0.5mm thick FR4 dielectric bottom plate with a foam block spacing of 3mm is placed into the mold. Mix phenolic resin with a weight ratio of 88:2:10, p-toluenesulfonic acid and hollow glass microspheres with a particle size of 10-40 μm, fill the mixture in the gaps between the foams, and combine the mixture with the above foam in the mold Completion of hot-press lamination, the lamination conditions are temperature control at 90°C, application of pressure at 9MPa, and keeping for 3 hours. The square metal ring is covered on the FR4 dielectric substrate. The thickness of the square metal ring structure is 38 μm. The outer side length of the square metal ring is 36 mm, ...
Embodiment 3
[0042] The selected base material is sendust foam. Select a foam board with a mesh aperture of 2 mm, a particle size of 80 μm, and a thickness of 20 mm, and process it into a square foam material of 30 × 30 × 15 mm; wrap the square foam material with a polyimide film with a thickness of 3 μm, Use epoxy resin to glue the foam block on the 1mm thick FR4 dielectric bottom plate, the distance between the foam blocks is 5mm, and put it into the mold. Mix phenolic resin with a weight ratio of 88:2:10, p-toluenesulfonic acid and hollow glass microspheres with a particle size of 15-40 μm, fill the mixture in the gaps between the foams, and combine the mixture with the above foam in the mold Completion of hot-press lamination, the lamination conditions are temperature control 80°C, applied pressure 9MPa, and keep for 3 hours. The square metal ring covers the FR4 dielectric substrate, the thickness of the square metal ring structure is 25 μm, the outer side length of the square metal r...
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