A broadband electromagnetic wave absorbing metamaterial based on the fusion of foam dielectric matrix material and metal structure
A metal structure and base material technology, applied in electrical components, antennas, etc., can solve the problems of poor electromagnetic wave absorption, large thickness and high density
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Embodiment 1
[0036] The base material was selected as carbon foam. Mesh size 1mm, conductivity 0.7s / m-1s / m, 200×200mm foam board, board thickness 20mm, processed into 20×20×10mm square foam material; the square foam material is made of polyimide with thickness 2μm Film wrap, epoxy the foam blocks to a 0.5mm thick FR4 dielectric base plate with a 2mm spacing between the foam blocks and place them into the mold. Mix the phenolic resin, p-toluenesulfonic acid and hollow glass beads with a particle size of 10-50 μm in a weight ratio of 88:2:10, fill the mixture in the gap between the foams, and place the mixture and the above-mentioned foam assembly in the mold The hot-pressing compounding was completed, and the compounding conditions were 90° C. temperature control, 9 MPa pressure applied, and maintained for 3 hours. The square metal ring covers the top of the FR4 dielectric substrate. The thickness of the square metal ring structure is 30μm. The outer length of the square metal ring is 40mm...
Embodiment 2
[0039] The selected base material is silicon carbide foam. Select mesh aperture 4mm, resistivity 10 3 -10 10 Ω·m, 200×200mm foam board, thickness 20mm; processed into 50×50×15mm square foam material; wrap the square foam material with polyimide film with a thickness of 3μm, and use epoxy resin to stick the foam block on On the 0.5mm thick FR4 dielectric base plate, the foam block spacing is 3mm, and put it into the mold. Mix the phenolic resin, p-toluenesulfonic acid and hollow glass microspheres with a particle size of 10-40 μm in a weight ratio of 88:2:10, fill the mixture in the gap between the foams, and place the mixture and the above-mentioned foam assembly in the mold The hot-pressing compounding was completed, and the compounding conditions were 90° C. temperature control, 9 MPa pressure applied, and maintained for 3 hours. The square metal ring covers the top of the FR4 dielectric substrate. The thickness of the square metal ring structure is 38μm. The outer length...
Embodiment 3
[0042] The selected base material is sendust foam. Select a foam board with a mesh aperture of 2 mm, a particle size of 80 μm, and a thickness of 20 mm, and process it into a square foam material of 30 × 30 × 15 mm; wrap the square foam material with a polyimide film with a thickness of 3 μm, Use epoxy resin to glue the foam block on the 1mm thick FR4 dielectric bottom plate, the distance between the foam blocks is 5mm, and put it into the mold. Mix phenolic resin with a weight ratio of 88:2:10, p-toluenesulfonic acid and hollow glass microspheres with a particle size of 15-40 μm, fill the mixture in the gaps between the foams, and combine the mixture with the above foam in the mold Completion of hot-press lamination, the lamination conditions are temperature control 80°C, applied pressure 9MPa, and keep for 3 hours. The square metal ring covers the FR4 dielectric substrate, the thickness of the square metal ring structure is 25 μm, the outer side length of the square metal r...
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