Machining test device and method for functionally gradient polishing plate

Abstract

The invention discloses a machining test device and method for a functionally gradient polishing plate. The machining test device comprises the polishing plate, a load pressure device, a whole rack and a speed adjusting and testing device, wherein the load pressure device comprises a testing support, an X-axis servo motor, an X-axis lead screw drive module, an X-axis slider, a Y-axis servo motor,a Y-shaft lead screw drive module, a Y-shaft slider, a load fixing clamp, an S-shaped force measurement sensor, a film force sensor, a test clamp and a test brittle material workpiece, wherein the speed adjusting and testing device comprises a Y-axis outer shaft, a manual speed adjusting box, an X axis, a first bevel gear, a second bevel gear, a bearing, a bearing support, a coupler and a speed adjusting motor. Through the structural design, it is achieved that four experiments are carried out on one experiment platform at the same time; by increasing the number of experiment groups in one experiment, the experiment time is relatively reduced; after 10 hours, the surface roughness of the workpice is detected by using a roughness detector, and the material removal rate is calculated by using a balance weighing method.

Description

technical field [0001] The present invention relates to the technical field of ultra-precision machining, and more specifically, relates to a processing and testing device and testing method for gradient function lapping discs. Background technique [0002] Hard and brittle materials such as sapphire, YAG crystals, special ceramics, and crystal materials have excellent characteristics such as high hardness, high melting point, good thermal stability, and stable chemical properties, and are widely used in national defense, aerospace, industry, and life. In the grinding and polishing process of hard and brittle materials, surface defects such as cracks, fracture zones, pits, protrusions and inclusions are often left on the wafer surface. Surface defects can be divided into the following types through research: [0003] 1) Concave defects, that is, inward defects, such as grooves, scratches, cracks, claws, edge chipping, notches, pits and streaks, etc.; [0004] 2) Convex defe...

AI Technical Summary

Problems solved by technology

[0008] The purpose of the present invention is to solve the problem that the existing experimental device cannot provide a complete process experiment test for the new ultra-precision processing technology, and a processing and testing device for the gradient function lapping disc is designed. The device provides a set of sapphire. Method for process testing of quasi-hard and brittle materials under a new ultra-precision machining technology based on uniform removal in gradient function grinding discs

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