Optical coupling chip solid-state relay (SSR) integrated circuit and plane type frame

Abstract

The invention provides an optical coupling chip solid-state relay (SSR) integrated circuit. The optical coupling chip SSR integrated circuit is characterized by comprising a plane type frame, a lightemitting part, a photoelectric receiving part, an internal packaging body and an external packaging body, the light emitting part and the photoelectric receiving part are arranged on the plane type frame, and located in the same plane. According to the optical coupling chip SSR integrated circuit, a traditional three-dimensional packaging structure is changed into an existing planar packaging structure, since the change of the isolation distance D in the planar package structure can be controlled, the optical coupling chip SSR integrated circuit can operate under various operating voltages, and the phenomenon of point discharge is avoided; and in addition, through arrangement of specially designed transparent silica gel and a white plastic package body, a light path is established in the plane through light emitted by an LED luminous tube, and more easily received by a photoelectric receiving tube, the efficiency of light transmission is improved, and performance of whole products is improved.

Description

technical field [0001] The invention relates to an optocoupler chip SSR integrated circuit and a planar frame. Background technique [0002] Solid-state relay, solid-state relay (SSR), including the main control end and the controlled end, generally the two ends are isolated from each other, the main control end is also called the input end, generally a low-power signal; and the controlled end is the output end, Controls the on or off of high power loads. [0003] The input end of the optocoupler solid state relay is an optocoupler composed of semiconductor circuits such as light-emitting diodes and phototransistors. The internal control circuit triggers the silicon-controlled rectifier, or power transistor, or IGBT at the output end, and then conducts the load current. [0004] 1. Characteristics of optocoupler solid state relays [0005] 1. Output and input isolation [0006] Optocoupler SSR has the most ideal isolation effect, and the isolation voltage can reach more t...

AI Technical Summary

Problems solved by technology

[0012] The main disadvantage of the three-dimensional packaging is that the production process is relatively complicated, requiring two sets of frames, and alignment operations are required during packaging, which increases the production cost.

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