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Preparation method of nano diamond composite coating tool silicon wafer

A nano-diamond and composite coating technology, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problems of excessively thick coating, coating film peeling, etc., to improve tool life, easy to control and operate, The effect of improving the structure

Inactive Publication Date: 2019-04-30
江苏沃德赛模具科技有限公司
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Problems solved by technology

[0004] The purpose of the present invention is to provide a nano-diamond composite coated cutting tool silicon chip preparation method to solve the problem of coating film falling off and coating being too thick to micron level proposed in the background art

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  • Preparation method of nano diamond composite coating tool silicon wafer

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Embodiment Construction

[0027] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention.

[0028] see figure 1 , an embodiment provided by the present invention: a method for preparing a nano-diamond composite coating cutting tool silicon wafer, comprising the following steps:

[0029] Step 1. Put the cemented carbide tool into a corrosive liquid for chemical treatment to form a stable chemical substance;

[0030] Step 2. Place the tool in the reaction chamber of the CVD equipment, and heat the power of the hot wire so that the temperature around the tool is 1600°C;

[0031] Step 3. Introduce a gas flow rate of 100-200ml of hydrogen and 50ml of methane into the reaction chamber of the CVD equipment, so that the reaction pressure in the CVD equipment is 5....

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Abstract

The invention relates to the technical field of diamond composite coating tool silicon wafer preparation methods, concretely to a preparation method of a nano diamond composite coating tool silicon wafer. The method includes the following steps: step1, putting a tool into corrosive liquid for mechanochemical treatment; step 2, putting the tool into a CVD equipment reaction chamber and adjusting temperature; step 3, synthesizing gas and controlling air pressure; and step 4, producing nucleation and growth. The preparation method of the nano diamond composite coating tool silicon wafer maintainshigh temperature by heating hot wires, thereby exciting a reaction of hydrogen and methane to form hydrogen atoms and carbon atoms, which promotes a reaction of the hydrogen and methane. Through theincrease of reaction pressure, the average free movement of the atoms is promoted, the collision freedom among the atoms is reduced, and a uniform nano diamond composite coating is deposited on the surface of the tool silicon wafer, thereby improving the bending strength and fracture toughness. The hardness of the nano diamond composite coating is equivalent of that of CBN, the life of the tool can be improved by twice, and the problem of coating falling off and coating being too thick to micron are solved.

Description

technical field [0001] The invention relates to the technical field of a method for preparing a diamond composite coated cutting tool silicon chip, in particular to a method for preparing a nanometer diamond composite coated cutting tool silicon chip. Background technique [0002] Coated tools are coated with a thin layer of refractory metal or non-metallic compound with good wear resistance on the surface of cemented carbide or high-speed steel (HSS) substrate with good strength and toughness (also can be coated Prepared on superhard material blades such as ceramics, diamond and cubic boron nitride). The coating acts as a chemical and thermal barrier, reducing the diffusion and chemical reactions between the tool and the workpiece, thereby reducing the wear of the substrate. Coated tools have the characteristics of high surface hardness, good wear resistance, stable chemical properties, heat resistance and oxidation resistance, small friction coefficient and low thermal co...

Claims

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Application Information

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IPC IPC(8): H01L21/02
CPCH01L21/02H01L21/0262H01L21/02697
Inventor 袁洋殷世春
Owner 江苏沃德赛模具科技有限公司