Preparation method of nano diamond composite coating tool silicon wafer
A nano-diamond and composite coating technology, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problems of excessively thick coating, coating film peeling, etc., to improve tool life, easy to control and operate, The effect of improving the structure
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[0027] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention.
[0028] see figure 1 , an embodiment provided by the present invention: a method for preparing a nano-diamond composite coating cutting tool silicon wafer, comprising the following steps:
[0029] Step 1. Put the cemented carbide tool into a corrosive liquid for chemical treatment to form a stable chemical substance;
[0030] Step 2. Place the tool in the reaction chamber of the CVD equipment, and heat the power of the hot wire so that the temperature around the tool is 1600°C;
[0031] Step 3. Introduce a gas flow rate of 100-200ml of hydrogen and 50ml of methane into the reaction chamber of the CVD equipment, so that the reaction pressure in the CVD equipment is 5....
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