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A Method for Measuring the Separation of Bending Wave and Torsional Wave in Combined Bending and Torsional Vibration of Structures

A bending-torsion combination, bending wave technology, applied in the measurement of ultrasonic/sonic/infrasonic waves, measuring devices, instruments, etc., to achieve the effect of strong operability and simple steps and principles

Active Publication Date: 2021-02-23
ZHEJIANG UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, in the existing technical methods in China, more are about the measurement and research of strain, displacement, pure bending, and pure torsion. As for the method that can separately study bending vibration and torsional vibration when the structure generates combined bending and torsional vibration, there is basically no method.

Method used

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  • A Method for Measuring the Separation of Bending Wave and Torsional Wave in Combined Bending and Torsional Vibration of Structures
  • A Method for Measuring the Separation of Bending Wave and Torsional Wave in Combined Bending and Torsional Vibration of Structures
  • A Method for Measuring the Separation of Bending Wave and Torsional Wave in Combined Bending and Torsional Vibration of Structures

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[0033] Such as Figure 4 As shown, this implementation case is to use the fiber Bragg grating sensing system to study the transient experiment of the combined vibration separation of phononic crystal bending and torsion, including a set of innovatively designed displacement sensing device for self-detuning single fiber grating, which has a broadband light source, Single optical fiber sensor, oscilloscope, charge amplifier, phononic crystal made of 6061 pure aluminum beam, fixed support, piezoelectric film and some optical circulators, etc.

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Abstract

The invention discloses a method for measuring the separation of bending waves and torsional waves in combined bending and torsion vibrations of structures. When a structure is subjected to steady-state, transient or random eccentric excitations, combined bending and torsional vibrations often occur. It is very difficult to measure the frequency response of bending or torsional vibration separately when testing the vibration of a structure. The method of the present invention selects two measurement points whose connection line passes through the geometric center of the normal section and is symmetrical about the geometric center on the normal section of the required measurement position of the measured structure, and performs simple addition and subtraction of the displacement response signals measured at the two points After processing, the bending vibration response signal and torsional vibration response signal can be obtained respectively, and the separation of bending wave and torsional wave can be realized, so as to better analyze the combined bending and torsion vibration mode of the structure.

Description

technical field [0001] The invention belongs to the field of mechanical vibration measurement, in particular to a method for measuring the separation of bending waves and torsional waves in the combined bending and torsional vibration of a symmetrical cross-section structure. Background technique [0002] Modal analysis is a modern method to study the dynamic characteristics of structures, and it is the application of system identification method in the field of engineering vibration. Modes are the natural vibration characteristics of mechanical structures, and each mode has a specific natural frequency, damping ratio, and mode shape. Vibration modes are an inherent, integral property of elastic structures. By using the modal analysis method to understand the main modal characteristics of each order of the structure in a certain susceptible frequency domain range, it is possible to predict the actual vibration response of the structure under the action of various external o...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01H17/00
Inventor 庄国志袁志文吕旭峰王宇涵王丹凤
Owner ZHEJIANG UNIV
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