Electroplating device capable of improving ion concentration of electrolyte

Abstract

The invention discloses an electroplating device capable of improving the ion concentration of electrolyte. The electroplating device comprises an electroplating treatment assembly, an electrolyte circulating assembly and a control unit. The electrolyte circulating assembly is connected with the electroplating treatment assembly and used for charging the electrolyte into the electroplating treatment assembly. The control unit is connected with the electrolyte circulating assembly and used for controlling the electric ion concentration of the electrolyte charged into a plurality of electroplating tanks of the electroplating treatment assembly to be consistent. The control unit is connected with the electroplating treatment assembly and used for regulating the conveying speed and tension ofa copper film in the electroplating process according to the concentration of the electrolyte in the electrolyte circulating assembly. In this way, the electroplating device provided by the inventioneffectively controls the consistency of the ion concentration of the electrolyte in all the electroplating tanks in a control mode of centralized control of the electrolyte circulating assembly and independent circulation of the electroplating treatment assembly.

Description

technical field [0001] The invention belongs to the technical field of electroplating devices, and in particular relates to an electroplating device capable of improving the ion concentration of electrolyte. Background technique [0002] The electroplating process has been widely used in various fields. In addition to the traditional surface treatment method, it is also used in the production of circuit boards, semiconductor chips, LED conductive substrates, and semiconductor packaging. Electroplating is to immerse the workpiece to be plated in an ionic solution containing electroplating metal, electrically connect the power supply to the cathode and anode (consumable or non-consumable) in the electroplating tank, and place the electroplated metal on the anode, and wait The plated workpiece is placed on the cathode, and a metal film layer will be deposited on the surface of the workpiece to be plated after the direct current is applied. [0003] Electroplating can prevent m...

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Problems solved by technology

[0004] The thickness uniformity of the coating has always been an important indicator for evaluating the performance of electroplating; the factors affecting the uniformity of thickness can be roughly divided into two categories: physical and chemical. The former includes the surface shape and surface area of ​​the workpiece to be plated, the temperature of the electroplating solution, and the liquid mixing, the distance between electrodes, whether to use shields, electrode materials, etc.; the latter includes the composition and concentration of the electroplating solution, the type of additives, etc.; reaction, the flow field distribution (current density) of the electroplating solution is particularly important; in fact, the current of the workpiece to be plated is dense in the convex area and loose in the concave area, so it is easy to form a coating with uneven thickness; but the existing electroplating The concentration of the electroplating solution in the device is not uniform, resulting in an uneven electrolytic layer

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