Tunnel-type hardening furnace for semiconductor device

Abstract

The invention discloses a tunnel-type hardening furnace for a semiconductor device. The tunnel-type hardening furnace for the semiconductor device is characterized by comprising a hardening surface base platform, a heating platform, a conveying mechanism, a furnace cover and an electric control platform, wherein the heating platform is arranged on the hardening surface base platform and is used for heating the semiconductor device; the conveying mechanism spans over two ends of the heating platform and conveys the semiconductor device to the heating platform by using a steel wire as a conveying tool; the furnace cover is arranged on the heating platform and is used for forming a tunnel-type heating chamber in the hardening surface base platform; the electric control platform is electrically connected with the heating platform and the conveying mechanism and is used for controlling heating and automatic conveying of the hardening furnace. According to the tunnel-type hardening furnace for the semiconductor device, manpower can be saved, the production efficiency can be improved, and meanwhile, the consistency of product quality is controlled.

Description

technical field [0001] The invention relates to the field of heating and hardening technology of electronic components, in particular to a tunnel type hardening furnace for semiconductor devices, especially for the rapid shaping process of LED packaging. Background technique [0002] At present, many electronic components need to undergo heating and hardening process during production and processing. Taking LED as an example, the common white LED uses the light generated by the blue chip to excite the phosphor to emit yellow-green light, which is matched with the blue light of the LED chip to produce white light. Phosphor powder is generally coated on the blue LED chip by dispensing process, and then hardened and formed. During the hardening process, due to the large specific gravity of the phosphor powder, sedimentation will occur in the liquid encapsulant, and the absorption and scattering characteristics of the phosphor layer for blue light will change greatly, resulting...

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Problems solved by technology

[0004] The purpose of the present invention is to provide a rapid heating and hardening equipment for semiconductor components, which aims to solve the problem that the existing rapid heating and hardening process requires manual processing, which cannot ensure consistency and low efficiency. In addition, uneven heating temperature and time control lead to inconsistent product quality technical issues

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