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3D printing device and method for preparing 3D printed structures

A 3D printing and structural layer technology, applied in the field of 3D printing, can solve the problems of difficult cleaning of the structure, low printing accuracy, and low utilization rate, and achieve the effect of good molding effect, improved utilization rate, and easy cleaning

Active Publication Date: 2020-07-31
INST OF CHEM CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a 3D printing device and a method for preparing a 3D printing structure in order to overcome the problems of low utilization rate of 3D printing raw materials, low printing accuracy, and printed structures that are difficult to clean and prone to defects in the prior art. The 3D printing structure prepared by the invented 3D printing device and method has high raw material utilization rate, high printing precision, good molding effect and easy cleaning

Method used

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  • 3D printing device and method for preparing 3D printed structures
  • 3D printing device and method for preparing 3D printed structures
  • 3D printing device and method for preparing 3D printed structures

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Experimental program
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Embodiment approach

[0050] According to an embodiment of the present invention, the light-emitting wavelength of the photocuring may be 200nm-1000nm, preferably 300-450nm. Specifically, photocuring is the curing of ink droplets caused by light with an emission wavelength of 200nm-1000nm, preferably 300-450nm. The ink droplets contain a photocurable resin, and the curing pattern is set to make the ink the same as the curing pattern. After solidification, the remaining uncured ink can dewetting and shrink as the receiving substrate rises. The volume of the ink is gradually consumed as it is solidified to form a solid structure, and the three-phase contact line of the ink drop is in the solidified layer ( The cured structure) and the cured plane are simultaneously retracted and de-wetted, so that a single curable printing ink droplet can be completely cured into a 3D printing structure by de-wetting.

[0051] According to another embodiment of the present invention, the thermal curing temperature may b...

specific Embodiment approach

[0061] According to a specific embodiment of the present invention, the 3D printing method includes the following steps, such as figure 1 with figure 2 Shown:

[0062] (1) Obtain the STL file of the target 3D printing, and select the ink droplets that can be printed, and calculate the weight of the required 3D printing ink droplets through the size parameters of the STL file and the density of the ink droplets. The surface of the non-wetting curing plane is controlled by a moving system to pass the ink drop through the receiving substrate so that the lower end surface of the receiving substrate is close to the curing plane.

[0063] (2) A curing pattern player is set to play the first curing pattern, and the curing medium provided by the curing system passes through the first curing pattern to cure the ink filled between the curing plane and the receiving substrate to form a The first cured layer of the first cured pattern.

[0064] (3) Move the receiving substrate upward, switch ...

preparation example 1

[0084] 7.5g of silicone rubber material liquid (purchased from Dow Corning, batch SYLGARD 184, initiator to curing agent ratio of 10:1), and 0.5g of heptafluorodecyl trimethoxysilane (fluorine-containing surface Active agent (purchased from Sigma-Aldrich Company) is mechanically stirred and mixed to obtain a cured plane with dewetting properties.

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Abstract

The invention relates to the field of 3D printing, and discloses a 3D printing device and a method for preparing a 3D printing structure. The 3D printing device includes a curing system, and a curing pattern player, a curing plane with de-wetting, and a receiving substrate that can be moved up and away from the curing plane are sequentially arranged above the curing system, wherein the curing plane is Used to place ink droplets; the curing pattern player is used to play curing patterns reflecting different structural layers of the target 3D printing structure; the curing medium provided by the curing system passes through the curing patterns, so that the curing plane and the receiving substrate are formed between The ink is cured. The 3D printing structure obtained by the 3D printing device has high utilization rate of raw materials, high printing precision and good molding effect.

Description

Technical field [0001] The invention relates to the field of 3D printing, in particular to a 3D printing device and a method for preparing a 3D printing structure. Background technique [0002] 3D printing is also known as additive manufacturing technology, a kind of rapid prototyping technology, which is based on digital model files and constructs three-dimensional objects through point-by-point or layer-by-layer printing. So far, according to the principle of three-dimensional molding, 3D printing technology can be divided into melt extrusion rapid prototyping, light curing three-dimensional molding, digital light processing, foil lamination molding, inkjet 3D printing, selective laser sintering, and electron beam Melt molding and solidification molding means by special initiating means, etc. Compared with traditional manufacturing, they do not require mold manufacturing or machining, and avoid the waste of materials and energy in traditional subtractive manufacturing processe...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B29C64/112B33Y30/00B33Y10/00
CPCB33Y30/00B33Y10/00B29C64/112B29C64/264B29C64/295B33Y70/00B29C64/245B29C64/286B33Y40/10B22F12/44B22F12/30B22F10/00
Inventor 吴磊宋延林
Owner INST OF CHEM CHINESE ACAD OF SCI