High temperature resistant water-cooled DC support capacitor
A DC support capacitor, high temperature resistance technology, applied in the direction of multilayer capacitors, multiple fixed capacitors, parts of fixed capacitors, etc., can solve the problem that the heat of the capacitor core is not easy to dissipate, and achieve a wide range of applications.
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[0031] Example 1
[0032] like figure 1 As shown, this figure is a front view of the present invention, wherein, the first heat sink 21 is L-shaped, and in order to place six heat dissipation assemblies 2 and each heat dissipation assembly 2 placed four layers of capacitor core subgroups 1 Schematic.
[0033] The high-temperature water-cooled DC support capacitor provided by the present invention includes a heat-dissipating aluminum plate 3, six heat-dissipating components 2 and twenty-four capacitor core subgroups 1. The six heat-dissipating components 2 are arranged side by side on the heat-dissipating aluminum plate 3, and the heat-dissipating components 2. It includes a first heat sink 21. In this embodiment, the first heat sink 21 is L-shaped. Four sets of capacitor core subgroups 1 are vertically stacked on the first heat sink 21. A second heat sink 22 is arranged between the adjacent two groups, one first heat sink 21 and three second heat sink 22 are integrally forme...
Example Embodiment
[0036] Example 2
[0037] like image 3 As shown, this figure is a front view of the present invention, wherein, the first heat sink 21 is U-shaped, and the five heat sink assemblies 2 are placed and each heat dissipation assembly 2 is placed in the four-layer capacitor core group 1. Schematic.
[0038] The high-temperature water-cooled DC support capacitor provided by the present invention includes a heat-dissipating aluminum plate 3, five heat-dissipating components 2 and twenty sets of capacitor core subgroups 1. The five heat-dissipating components 2 are arranged side by side on the heat-dissipating aluminum plate 3, and the heat-dissipating components 2 It includes a first heat sink 21. In this embodiment, the first heat sink 21 is U-shaped. Four groups of capacitor core subgroups 1 are vertically stacked on the first heat sink 21, and each phase of the vertically stacked capacitor core subgroups 1 A second heat sink 22 is arranged between the adjacent two groups. One f...
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