Ceramic circuit board

A technology of circuit boards and ceramics, which is applied in the direction of circuit substrate materials, printed circuit components, etc., can solve the problems of reducing the thermal conductivity of ceramic circuit boards, not easy to cut and punch holes, and high manufacturing costs, so as to achieve easy cutting and punching and high pass rate , to avoid the effect of brittle structure

Inactive Publication Date: 2019-05-21
江西增孚新材料科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing ceramic circuit board structure on the market includes a bare ceramic board and a circuit board covering the surface of the bare ceramic board, which mainly has the following problems: 1. The existing ceramic circuit board structure is hard and brittle, not easy to cut and punch, and easy to be damaged; 2. The existing ceramic circuit boards are doped with a high proportion of glass materials and organic binders. The production process requires a high-temperature environment, which results in high manufacturing costs and low pass rates, and high proportions of glass materials and organic binders. Impurities greatly reduce the thermal conductivity of ceramic circuit boards

Method used

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  • Ceramic circuit board

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Embodiment

[0017] A ceramic circuit board, comprising a metal substrate layer 1, a ceramic insulating and heat-conducting layer 2 and a graphene heat-dissipating coating 3, the ceramic insulating and heat-conducting layer 2 covering the upper surface of the metal substrate layer 1, and the graphene heat-dissipating coating 3 covering the metal substrate layer 1 the lower surface, the ceramic insulating and heat-conducting layer 2 the upper surface is fixed with a circuit board.

[0018] Wherein, the metal substrate layer 1 is made of high thermal conductivity alloy material, and the thickness of the metal substrate layer 1 is any value within the range of 0.05-2 mm. Preferably, the metal substrate layer 1 is selected from one of copper substrate layers, aluminum alloy substrate layers or iron alloy substrate layers.

[0019] Working principle: After the circuit board is laid and packaged on the ceramic insulating and heat-conducting layer 2, the heat generated by the operation of the cir...

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Abstract

The invention discloses a ceramic circuit board, comprising a metal substrate layer, a ceramic insulation heat conduction layer and a graphene heat dissipation coating; the ceramic insulation heat conduction layer covers the upper surface of the metal substrate layer, the graphene heat dissipation coating covers the lower surface of the metal substrate layer, and a circuit board is fixed on the upper surface of the ceramic insulation heat conduction layer, wherein the metal substrate layer is made of a high-thermal-conductivity alloy material, and the ceramic insulation heat conduction layer is composed of an adhesive and a ceramic inorganic filling material. The ceramic circuit board in the invention has excellent heat conductivity, the defect that the existing ceramic circuit board is brittle and hard is overcome, the ceramic circuit board is easy to cut and punch, the manufacturing cost is low, and the percent of pass is high.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a ceramic circuit board. Background technique [0002] Ceramics have reliable insulation and heat dissipation capabilities, and their use as circuit board substrates has great advantages. The existing ceramic circuit board structure on the market includes a bare ceramic board and a circuit board covering the surface of the bare ceramic board, which mainly has the following problems: 1. The existing ceramic circuit board structure is hard and brittle, not easy to cut and punch, and easy to be damaged; 2. The existing ceramic circuit boards are doped with a high proportion of glass materials and organic binders. The production process requires a high-temperature environment, which results in high manufacturing costs and low pass rates, and high proportions of glass materials and organic binders. Impurities greatly reduce the thermal conductivity of ceramic circuit boards. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/03H05K1/05
Inventor 金度亨赖俊刚
Owner 江西增孚新材料科技有限公司
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