A laser processing equipment with straight-through microchannel cooling device
A heat dissipation device and laser processing technology, which is applied in laser welding equipment, metal processing equipment, lasers, etc., can solve the problems that cannot meet the heat dissipation requirements of high-power lasers, and achieve the effects of compact structure, good cooling effect, and improved efficiency
Active Publication Date: 2021-07-23
苏州匠恒智造科技有限公司
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Problems solved by technology
[0005] The purpose of the present invention is to provide a laser processing equipment with a straight-through microchannel heat dissipation device to solve the problem that the traditional heat dissipation method in the prior art cannot meet the heat dissipation requirements of high-power lasers
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[0024] The implementation of the present invention will be illustrated by specific specific examples below, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. Although the description of the present invention will be presented in conjunction with a preferred embodiment, it does not mean that the features of the invention are limited to this embodiment. On the contrary, the purpose of introducing the invention in conjunction with the embodiments is to cover other options or modifications that may be extended based on the claims of the present invention. The following description contains numerous specific details in order to provide a thorough understanding of the present invention. The invention may also be practiced without these details. Also, some specific details will be omitted from the description in order to avoid obscuring or obscuring the gist of the present invent...
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The present invention relates to the technical field of laser processing, in particular to a laser processing device with a through-type micro-channel heat dissipation device, including a frame and a laser head arranged on the frame, the laser head is provided with a through-type micro-channel heat dissipation device, and the The semiconductor laser is set on the upper cover of the straight-through microchannel cooling device. When the laser head is working, the area where the semiconductor laser is installed on the upper cover will form a high-temperature area. The channel can ensure that enough liquid remains in the heat dissipation plate and promote the flow of liquid in the heat dissipation cavity, which can quickly cool down the high temperature area. The present invention can stably, reliably, efficiently and quickly lower the temperature in the high-temperature region by setting the through-type micro-channel cooling device, so that the semiconductor laser can work stably and reliably, thereby ensuring the reliability of the performance of the entire laser processing equipment, and ensuring that the laser processing equipment can be stable and reliable , Fast and efficient processing.
Description
technical field [0001] The invention relates to the technical field of laser processing, in particular to a laser processing device with a straight-through microchannel cooling device. Background technique [0002] Laser processing is the most common application for laser systems, of which laser thermal processing is the most common form of application. Specifically, laser thermal processing refers to the use of the thermal effect generated by the laser beam projected on the surface of the material to complete the processing process, including laser welding, laser cutting, surface modification, laser laser marking, laser drilling and micromachining, etc. In the laser thermal processing system, the semiconductor laser is the core component, which is used to generate high-intensity laser beams. [0003] In recent years, with the improvement of user needs and the deepening of research, the performance of high-power semiconductor lasers has been rapidly improved. However, as t...
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IPC IPC(8): B23K26/70H01S5/024
Inventor 曹海东王跃辉
Owner 苏州匠恒智造科技有限公司