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Gate turn-off control method and device of silicon carbide field effect transistor and driving circuit

A silicon carbide field and turn-off control technology, which is applied in the field of power electronics, can solve the problems of device damage, affecting the size and increase of the overshoot voltage of the silicon carbide field effect tube, so as to ensure the safe operation of the circuit, avoid the phenomenon of device damage, and solve the problem. Effects of crosstalk problems

Inactive Publication Date: 2019-05-31
湖南德雅坤创科技有限公司
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  • Application Information

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Problems solved by technology

However, as for the most suitable gate turn-off voltage, there is no specific solution given in the prior art. In fact, different gate turn-off voltages will affect the performance of SiC FETs. Overshoot voltage, once the overshoot voltage is too large, the risk of device damage will increase

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  • Gate turn-off control method and device of silicon carbide field effect transistor and driving circuit
  • Gate turn-off control method and device of silicon carbide field effect transistor and driving circuit
  • Gate turn-off control method and device of silicon carbide field effect transistor and driving circuit

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Embodiment Construction

[0046] The core of the present application is to provide a silicon carbide field effect transistor gate turn-off control method, device and a silicon carbide field effect transistor drive circuit, so as to adopt a scientific and reasonable gate turn-off voltage The turn-off control of silicon carbide field effect transistors can solve the problem of crosstalk and avoid device damage due to excessive overshoot voltage, effectively ensuring the safety of circuit operation.

[0047] In order to describe the technical solutions in the embodiments of the present application more clearly and completely, the technical solutions in the embodiments of the present application will be introduced below in conjunction with the drawings in the embodiments of the present application. Apparently, the described embodiments are only some of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary sk...

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Abstract

The invention discloses a grid turn-off control method. The grid turn-off control method comprises the steps of obtaining parasitic parameters of a silicon carbide field effect transistor; judging themonotonous relationship between the overshoot voltage and the gate turn-off voltage of the silicon carbide field effect transistor according to the parasitic parameters; determining an optimal valueof the gate turn-off voltage in a preset value interval according to the monotonic relationship, wherein the gate turn-off voltage enables the overshoot voltage to obtain the minimum value in the interval at the optimal value; and outputting the gate turn-off voltage with the optimal value to the gate of the silicon carbide field effect transistor so as to turn off the silicon carbide field effecttransistor. According to the invention, the gate turn-off voltage with a small overshoot voltage value is selected to carry out turn-off control on the silicon carbide field effect transistor, so that the crosstalk problem is solved, the drain-source voltage oscillation can be effectively inhibited, the device damage phenomenon caused by overshoot voltage is avoided, and the circuit operation safety is ensured. The invention also discloses a gate turn-off control device of the silicon carbide field effect transistor and a driving circuit, which also have the above beneficial effects.

Description

technical field [0001] The present application relates to the technical field of power electronics, in particular to a gate turn-off control method and device for a silicon carbide field effect transistor, and in particular to a driving circuit for a silicon carbide field effect transistor. Background technique [0002] SiC-based power electronic devices can effectively improve the performance of power electronic converters such as efficiency and power density due to their excellent characteristics such as high frequency, high voltage resistance, and high temperature resistance. However, as the device switching frequency increases, the rate of change of voltage and current during the switching process also increases. The existence of parasitic inductance and parasitic capacitance causes severe oscillation of the switching waveform, and device stress, electromagnetic interference (EMI) and switching tubes Loss is a serious problem. Since the gate threshold voltage of silicon...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H03K17/687H03K17/0812H03K17/16
Inventor 李建成陈一平李乐乐陈亮
Owner 湖南德雅坤创科技有限公司
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