Release film and preparation method thereof

A technology of release film and release layer, which is applied in the direction of chemical instruments and methods, synthetic resin layered products, layered products, etc. It can solve the problem of PET substrates not having release properties, uneven peeling force, silicone oil loss, etc. Problems, achieve low cost, improve antistatic and mold release, and prolong service life

Active Publication Date: 2019-06-04
NINGBO CHANGYANG TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The common release film is polyethylene terephthalate (PET), but the PET substrate itself does not have release properties.

Method used

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  • Release film and preparation method thereof
  • Release film and preparation method thereof
  • Release film and preparation method thereof

Examples

Experimental program
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Effect test

preparation example Construction

[0048] The present invention also provides a kind of preparation method of release film, and this preparation method comprises the steps:

[0049] Step 1, surface-treating the inorganic nano-particles to have dispersing groups on the surface. Specifically, the silane coupling agent is added to ethanol, and then inorganic nanoparticles are added, the above mixture is stirred and centrifuged, and the clear liquid located in the upper layer is poured off to obtain the mixture; the obtained mixture is added to absolute ethanol for washing, and dried Inorganic nanoparticles with dispersed groups on the surface are obtained.

[0050] Step 2, forming a release layer, the surface of the release layer is formed with a hollow bubble structure. Specifically, the raw materials of the release layer and the surface-modified inorganic nanoparticles are uniformly mixed according to the proportion and added to the auxiliary extruder.

[0051] Step 3, forming a tolerance layer. Specifically,...

Embodiment 1

[0067] For the release film provided in this embodiment, the release layer ratio is 93% poly-4-methylpentene, 3.5% silica nanoparticles, and 3.5% polythiophene antistatic agent; the poly-4- The molecular weight of methylpentene is 100,000 g / mol, the particle size of silica particles is 70 nm, and the surface is modified with octyltrimethoxysilane. The proportion of the containment layer is 20% low density polyethylene, 80% polypropylene. The electrostatic layer is arranged on both sides of the tolerance layer. The total thickness of the release layer accounts for 40% of the total thickness and its outer surface is embossed. The thickness of the tolerance layer accounts for 60% of the total thickness. The thickness of the obtained reflective film is 120μm. See Table 2.

Embodiment 2

[0069] The same parts as those in Example 1 will not be repeated, and the difference from Example 1 is that the outer surface has not been embossed, and the thickness of the B layer accounts for 60% of the total thickness. The thickness of the obtained reflective film is 120 μm, and the relevant properties are shown in Table 2.

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Abstract

The invention relates to a release film. The release film comprises a release layer, the surface of the release layer has bulges, which are composed of hollow foam-like structures. Because of the existence of the hollow foam-like structures, the release film has good demoulding performance and certain buffering effect, thus being a release film with excellent performance. The invention also provides a preparation method of the release film.

Description

technical field [0001] The invention relates to the field of film materials, in particular to a release film and a preparation method thereof. Background technique [0002] Flexible printed circuit board (Flexible Printed Circuit, abbreviated as FPC) refers to the base material of polyester film or polyimide, which is made of copper foil by etching to form a circuit with high reliability and excellent Flexible printed circuits. FPC can be bent, wound, and folded freely, and the volume of electronic products can be greatly reduced by using FPC, which is suitable for the development of electronic products in the direction of high density, miniaturization, and high reliability. [0003] FPC can be divided into single-sided board, double-sided board, hollow board and multi-layer board. When manufacturing flexible printed circuit boards, it is necessary to set a covering protective layer on the substrate forming the circuit to prevent water and oxygen from corroding the circuit...

Claims

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Application Information

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IPC IPC(8): B32B7/06B32B3/30B32B27/18B32B27/08B32B3/08B32B33/00
Inventor 金亚东汪太生杨承翰
Owner NINGBO CHANGYANG TECH
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