A magnetic imaging test method and device for three-dimensional current of an integrated circuit

Abstract

The invention discloses a magnetic imaging test method and device for three-dimensional integrated circuit current. The magnetic imaging device includes a chip-level atomic magnetometer, a giant magnetoresistance sensor, a photoelectric ranging sensor, a circuit test probe, a movable detection platform and a computer; The three-dimensional current magnetic imaging test method includes: using Fourier transform to convert the magnetic field data scanned by the chip-level atomic magnetometer into a current density image; establishing a three-dimensional simulation magnetic field model according to the current path design layout of the sample package; changing variables to solve the biot- The Savart equation compares the original magnetic field data with the simulated magnetic field data, and determines the distance between the current and the sensor by matching the magnetic field strength; calculates the actual depth of the current, and creates a three-dimensional current density image based on the actual current depth and the current density image. The device is small in size, fast in measurement speed, simple in process and convenient in operation, and can perform effective magnetic imaging measurement of three-dimensional current in integrated circuits.

Description

technical field [0001] The invention relates to the technical field of measurement, in particular to a method and device for magnetic imaging testing of three-dimensional current of an integrated circuit. Background technique [0002] Because magnetic fields can penetrate most materials used in the semiconductor industry, with unique capabilities not found in other technologies, they have become an important technique for detecting shorts, leakages, and opens in integrated circuit (IC) samples. Magnetoelectric imaging is a magnetic field imaging technique that senses the magnetic field generated by the current in the circuit by scanning the integrated circuit. The magnetic field image is converted into a current density image by using Fourier transform inversion technique. [0003] In order to determine the fault location, the current density image needs to be superimposed on the optical or near-infrared image, and the difference between the two needs to be compared to dete...

AI Technical Summary

Problems solved by technology

With the development of through-silicon via technology, the packaging form of integrated circuits will become a chip stacking form, the packaging will become more complex, and the positioning of defects will become correspondingly more difficult

The existing method of confirming the fault location has become obsolete because it can only be used to determine the fault location of the two-dimensional plane of the integrated circuit, but cannot determine the fault depth by stacking metal layers and observe the current signal

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