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A micro-electro-mechanical sensor packaging structure and a manufacturing method

A micro-electromechanical sensor and packaging structure technology, applied in the direction of micro-structure technology, micro-structure devices, processing micro-structure devices, etc., can solve problems such as complex process flow, low production efficiency, and low product yield rate, and achieve simplified process flow, Effect of reducing error and controlling consistency

Pending Publication Date: 2019-06-07
无锡韦感半导体有限公司
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  • Description
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Problems solved by technology

[0004] The purpose of the present invention is to provide a micro-electromechanical sensor packaging structure and manufacturing method to solve the problems of high production cost, complicated process flow, low product yield, poor consistency and low production efficiency in the prior art

Method used

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  • A micro-electro-mechanical sensor packaging structure and a manufacturing method
  • A micro-electro-mechanical sensor packaging structure and a manufacturing method
  • A micro-electro-mechanical sensor packaging structure and a manufacturing method

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Embodiment Construction

[0039] Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings. In the various figures, identical elements are indicated with similar reference numerals. For the sake of clarity, various parts in the drawings have not been drawn to scale. Also, some well-known parts may not be shown. For the sake of simplicity, the semiconductor structure obtained after several steps can be described in one figure.

[0040] It should be understood that when describing a structure, when a layer or a region is referred to as being “on” or “over” another layer or another region, it may refer to being directly on or above the other layer or another region. Other layers or regions are included between another layer and another region. And, if the device is turned over, the layer, one region, will be "below" or "beneath" the other layer, another region.

[0041] If it is to describe the situation directly on another layer or another area, t...

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Abstract

The invention discloses a micro-electro-mechanical sensor packaging structure and a manufacturing method. The micro-electro-mechanical sensor packaging structure comprises a first substrate; a secondsubstrate which is arranged on one side of the first substrate; a shell which is arranged on the other side of the first substrate, wherein a cavity is formed between the shell and the first substrate; a chip which is arranged on the inner side of the shell, is positioned in the cavity and is electrically connected with the first substrate through a metal wire; Wherein the first substrate is provided with a first through hole, the area of the first through hole is larger than that of the chip, and the position of the first through hole corresponds to that of the chip. The MEMS sensor packagingstructure which needs to be produced one by one originally can realize batch production of the whole board, is beneficial to control of consistency of produced products, improves the production efficiency and the product yield, simplifies the technological process, and reduces the production cost.

Description

technical field [0001] The present invention relates to the technical field of micro-electromechanical sensors, and more specifically, to a micro-electromechanical sensor packaging structure and a manufacturing method. Background technique [0002] The packaging of MEMS sensor components has different functions. Encapsulation protects components from mechanical and chemical environmental influences. In addition, the type of construction of the package determines how all components are mounted and wired. Of particular importance in this construction is the housing. In the micro-electromechanical sensor, the shell undertakes part of the sensor function, and plays the role of transmitting and buffering physical information such as sound, pressure, acceleration, etc., because the non-electrical physical quantity finally received by the sensor sensitive chip is also determined by the configuration of the shell. sure. The housing thus has a significant influence on the transfe...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B81B7/00B81C3/00
Inventor 万蔡辛
Owner 无锡韦感半导体有限公司
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