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Hardware, micro-electromechanical sensor packaging structure and manufacturing method

A micro-electromechanical sensor and packaging structure technology, applied in the direction of micro-structure technology, micro-structure devices, processing micro-structure devices, etc., can solve the problems of complex process flow, low product yield, low production efficiency, etc., and achieve simplified process flow, Reduce wear and cutting time, and facilitate placement

Active Publication Date: 2021-09-24
无锡感芯科技有限公司
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  • Application Information

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Problems solved by technology

[0004] The purpose of the present invention is to provide a hardware, MEMS sensor packaging structure and manufacturing method to solve the problems of high production cost, complicated process flow, low product yield, poor consistency and low production efficiency in the prior art

Method used

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  • Hardware, micro-electromechanical sensor packaging structure and manufacturing method
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  • Hardware, micro-electromechanical sensor packaging structure and manufacturing method

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Embodiment Construction

[0044] Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings. In the various figures, identical elements are indicated with similar reference numerals. For the sake of clarity, various parts in the drawings have not been drawn to scale. Also, some well-known parts may not be shown. For the sake of simplicity, the semiconductor structure obtained after several steps can be described in one figure.

[0045] It should be understood that when describing a structure, when a layer or a region is referred to as being “on” or “over” another layer or another region, it may refer to being directly on or above the other layer or another region. Other layers or regions are included between another layer and another region. And, if the device is turned over, the layer, one region, will be "below" or "beneath" the other layer, another region.

[0046] If it is to describe the situation directly on another layer or another area, t...

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Abstract

The application discloses a hardware, a package structure of a microelectromechanical sensor and a manufacturing method. The hardware includes: a plurality of shells, and the shells are connected by connecting ribs; wherein, the shell includes a top surface and a side surface. The top surface and the connecting rib are in the same plane. The hardware is obtained by processing the metal plate through the panel design of the shell, so that the package structure of the MEMS sensor that needs to be produced one by one can realize the mass production of the whole board, which is beneficial to control the consistency of the production products and improve the production efficiency. and product yield, and simplify the process flow and reduce production costs. In the manufacture of the MEMS sensor package structure, the stencil is used to coat the connection material to effectively control its thickness and uniformity, ensure the connection quality of the product, and provide sufficient space for the setting of the metal wire through the solder mask layer. .

Description

technical field [0001] The present invention relates to the technical field of microelectromechanical sensors, and more specifically, to a hardware and a microelectromechanical sensor packaging structure using the hardware. Background technique [0002] The packaging of MEMS sensor components has different functions. Encapsulation protects components from mechanical and chemical environmental influences. Furthermore, the type of encapsulation or housing determines how the components are installed and connected at the place of use. Of particular importance here are housings for SMT (surface mounting technology) mounting. In the micro-electromechanical sensor, the shell undertakes part of the sensor function, and plays the role of transmitting and buffering physical information such as sound, pressure, acceleration, etc., because the non-electrical physical quantity finally received by the sensor sensitive chip is also determined by the configuration of the shell. sure. Th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B81B7/00B81B7/02B81C3/00
Inventor 万蔡辛
Owner 无锡感芯科技有限公司
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