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Micro-electro-mechanical sensor packaging structure and manufacturing method

A micro-electromechanical sensor and packaging structure technology, which is applied in the direction of microelectronic microstructure devices, microstructure technology, microstructure devices, etc., can solve the problems of complex process flow, low product yield, low production efficiency, etc., and achieve simplified process flow , control consistency, reduce the effect of production steps

Pending Publication Date: 2019-07-26
无锡韦感半导体有限公司
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  • Abstract
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Problems solved by technology

[0004] The purpose of the present invention is to provide a micro-electromechanical sensor packaging structure and manufacturing method to solve the problems of high production cost, complicated process flow, low product yield, poor consistency and low production efficiency in the prior art

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  • Micro-electro-mechanical sensor packaging structure and manufacturing method
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  • Micro-electro-mechanical sensor packaging structure and manufacturing method

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Embodiment Construction

[0042] Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings. In the various figures, identical elements are indicated with similar reference numerals. For the sake of clarity, various parts in the drawings have not been drawn to scale. Also, some well-known parts may not be shown. For the sake of simplicity, the semiconductor structure obtained after several steps can be described in one figure.

[0043] It should be understood that when describing a structure, when a layer or a region is referred to as being “on” or “over” another layer or another region, it may refer to being directly on or above the other layer or another region. Other layers or regions are included between another layer and another region. And, if the device is turned over, the layer, one region, will be "below" or "beneath" the other layer, another region.

[0044] If it is to describe the situation directly on another layer or another area, t...

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Abstract

The invention discloses a micro-electro-mechanical sensor packaging structure and a manufacturing method, and the micro-electro-mechanical sensor packaging structure comprises a first substrate whichis provided with a concave structure; a second substrate arranged on the first substrate; and a chip arranged in the concave structure, and the chip is electrically connected with the first substratethrough a metal wire. The concave structure enables a cavity to be formed between the second substrate and the first substrate, and the area of the bottom surface of the concave structure is larger than that of the chip. According to the packaging structure, independent manufacturing and mounting of the shell are omitted. The shell which originally needs to be manufactured separately and mounted separately is integrated into the first substrate, miniaturization of products is facilitated, the production cost is saved, the types of equipment needed by production are reduced, the production steps are reduced, the consistency of produced products is further facilitated to be controlled, and the production efficiency and the product yield are improved while batch production is achieved.

Description

technical field [0001] The present invention relates to the technical field of micro-electromechanical sensors, and more specifically, to a micro-electromechanical sensor packaging structure and a manufacturing method. Background technique [0002] The packaging of MEMS sensor components has different functions. Encapsulation protects components from mechanical and chemical environmental influences. In addition, the type of construction of the package determines how all components are mounted and wired. Of particular importance in this construction is the housing. In the micro-electromechanical sensor, the shell undertakes part of the sensor function, and plays the role of transmitting and buffering physical information such as sound, pressure, acceleration, etc., because the non-electrical physical quantity finally received by the sensor sensitive chip is also determined by the configuration of the shell. sure. The housing thus has a significant influence on the transfe...

Claims

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Application Information

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IPC IPC(8): B81B7/02B81C1/00
CPCB81B7/02B81B2201/0257B81B2207/09B81B2207/096B81C1/00269
Inventor 万蔡辛
Owner 无锡韦感半导体有限公司
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