Method for preparing liquid-metal-based anisotropic conductive adhesive

Abstract

The invention discloses a method for preparing a liquid-metal-based anisotropic conductive adhesive. The anisotropic conductive adhesive prepared through combining low-melting-point liquid metal and an adhesive is easy to process and form and has good conductive anisotropic property and excellent bonding property. The method comprises the steps: (1) preparation of the liquid-metal anisotropic conductive adhesive: dispersing the liquid metal in the adhesive so as to obtain a mixture of liquid metal particles and the adhesive, removing bubbles from the mixture, and storing the mixture for lateruse; and (2) use method of the liquid-metal anisotropic conductive adhesive: coating a matrix with the debubbled mixture of the liquid metal particles and the adhesive, placing another matrix on the mixture, and carrying out curing forming, thereby obtaining the liquid-metal conductive adhesive. A temperature is set according to a vitrification temperature of the conductive adhesive, a force is applied to the conductive adhesive at the temperature, the temperature is restored to room temperature, and then, the conductive adhesive has excellent electric conductivity along a force direction andis in an insulation state vertical to the force direction.

Description

technical field [0001] The invention belongs to the technical field of materials, and in particular relates to a preparation method of liquid metal-based anisotropic conductive adhesive. Background technique [0002] Anisotropic Conductive Adhesives (ACAs for short) have unique conductive anisotropy, that is, there are differences in electrical conductivity (or resistivity) in three dimensions (x, y, and z). With the advent of the electronic information age, ACAs combine the unique advantages of polymers such as light weight, easy processing and molding, and the excellent electrical properties of conductive fillers. Thermal and other physical characteristics are favored by people, and are widely used in packaging links, electronic components, optical components, displays and other fields. By precisely controlling the distribution of conductive fillers in the adhesive matrix, the conduction and bonding can only be achieved in the z-axis direction, while good insulation can b...

AI Technical Summary

Problems solved by technology

Bisphenol A type epoxy resin conductive adhesive has good electrical conductivity, but poor mechanical properties

On the one hand, due to its high cross-linking density and rigidity, bisphenol A epoxy resin as the base epoxy conductive adhesive has shortcomings such as great brittleness and poor flexibility; on the other hand, in order to achieve If the conductivity is expected, a large amount of traditional conductive fillers such as silver and copper must be filled in the epoxy resin collective, and this will lead to a significant decrease in the mechanical properties of the cured product, which limits its application in flexible electronic appliances, aerospace and other fields. application

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