Copper ion supplementing device and method for electroplating

A technology of copper ions and electroplating solution, which is applied in the direction of electrolysis process, electrolysis components, cells, etc., can solve the problems of component concentration fluctuation, unfavorable quality control, lack of dissolved copper, etc., so as to keep the component concentration stable, avoid negative effects, Favorable effect of continuous supplementation

Pending Publication Date: 2019-06-21
GUANGDONG SKYCHEM TECH LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The entire supplementary process lacks effective means of controlling the amount of dissolved copper. The amount of dissolved copper can only be adjusted by changing the flow rate of the electroplating solution. The fluctuation is not conducive to quality control

Method used

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  • Copper ion supplementing device and method for electroplating
  • Copper ion supplementing device and method for electroplating

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0044] This embodiment provides a copper ion supplement device for electroplating. The device includes a tank body 1, a centrifugal pump 4, and a liquid storage tank 2. The tank body 1 is divided into 5 independent tank chambers by a partition 1.2. The bottom of the tank is provided with a porous partition 1.1, and each tank is equipped with copper balls (grains) 7. The bottom of the tank is in communication with the liquid storage tank 2 and there is a flow regulating valve 5 between them. The centrifugal pump 4 is located Between the liquid storage tank 2 and the tank body 1, the output end of the centrifugal pump 4 is connected with 5 delivery pipelines, each delivery pipeline corresponds to a tank chamber, which is used to transport the electroplating solution into the tank chamber. The output ends are respectively equipped with electric valves 6.1-6.5.

[0045] The device in this embodiment also includes a liquid level monitoring device 3 connected to the tank chamber, and t...

Embodiment 2

[0048] This embodiment provides a copper ion supplement method for electroplating. The copper ion supplement device provided in Example 1 is used for copper ion supplementation. The specific operations of the method are:

[0049] Select the specific amount of dissolved copper according to the actual working conditions on site, open the valves 6.1 to 6.3 on the delivery pipeline, close 6.4 and 6.5, and transport the electroplating solution in the storage tank 2 through the delivery pipeline to the opened tank chamber through the centrifugal pump 4 , According to the real-time feedback of the liquid level in the tank by the liquid level monitoring device 3, the flow regulating valve 5 is used to adjust the flow of the electroplating solution to keep the liquid level in the tank stable, and the electroplating solution after replenishing copper ions enters the storage tank 2. Used for electroplating.

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Abstract

The invention relates to a copper ion supplementing device and method for electroplating. The device comprises a groove body, a centrifugal pump and a liquid storage groove; multiple independent groove chambers are arranged in the groove body, porous partition boards are arranged on the bottoms of the groove chambers, the bottom of the groove chamber and the liquid storage groove communicate, a flow adjusting valve is arranged between the groove chamber and the liquid storage groove, the centrifugal pump is located between the liquid storage groove and the groove body, the output end of the centrifugal pump is connected with multiple conveying pipelines, each conveying pipeline corresponds to one groove chamber, and is used for conveying electroplating liquid to the groove chamber, and a valve is arranged on the output end of each conveying pipeline. Through improvement of a copper soluble device structure, the electroplating liquid flow and the copper soluble amount can be precisely controlled, in the whole supplementing process, the centrifugal pump continuously works, the component concentration of the electroplating liquid is kept stable, and the good application prospect is achieved.

Description

Technical field [0001] The invention relates to the field of electroplating, in particular to a copper ion supplement device and method for electroplating. Background technique [0002] Electroplating is to use the base metal to be plated as the cathode in the electroplating solution containing the pre-plated metal. Through electrolysis, the cations of the pre-plated metal in the plating solution are deposited on the surface of the base metal to form a plating layer. The plating layer formed can enhance the corrosion resistance of the base metal, increase the hardness, prevent abrasion, and improve the conductivity, smoothness, heat resistance and surface aesthetics, and has been widely used in recent years. [0003] Among them, the main components of the electroplating solution are main salt (to provide ions for electrodeposition metal), conductive salt (to increase the conductivity of the solution), anode active agent (to promote anode dissolution and increase anode current densi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D21/14C25D17/00C25D3/38
CPCY02P10/20
Inventor 刘江波章晓冬冯建松苏向荣
Owner GUANGDONG SKYCHEM TECH LTD
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