Acoustic tweezers device

Abstract

The invention discloses an acoustic tweezers device. The acoustic tweezers device comprises an ultrasonic emitting mechanism, and a waveguide structure arranged on the ultrasonic emitting mechanism; the ultrasonic emitting mechanism is used for emitting ultrasonic waves; and the waveguide structure is used for conducting the ultrasonic waves. The acoustic tweezers device further comprises a resonant unit body arranged on the waveguide structure; the ultrasonic waves excite the resonant unit body for resonance; and a local area field for capturing particles is generated on the surface of the resonant unit body. The used ultrasonic frequency is lower, and the precise phase modulation is not needed, so that a transducer is easily machined and manufactured, and no complicated electronic systemis needed; a low-frequency sound field emitting mode is modulated only through the designed resonant unit body; and the local area field is generated on the surface of the resonant unit body to realize such operations as capturing of micron-scale particles. When the ultrasonic emitting mechanism is turned off, due to loss of the sound radiation force, the captured particles on the surface of theresonant unit body can be released. The acoustic tweezers device is simple in manufacturing process and low in cost, and can achieve mass production.

Description

technical field [0001] The present application relates to the field of manipulation of micro-nano particles, in particular to an acoustic tweezers device. Background technique [0002] At present, single-beam acoustic tweezers are mainly realized in two ways: single-element high-frequency ultrasonic Gaussian beam and multi-array element phase-controlled vortex acoustic beam. These two methods have high requirements on the transducer processing technology or the design of the electronic system. For example, in order to realize the high-frequency ultrasonic Gaussian beam, a higher level of piezoelectric crystal grinding process is required. To emit a 100MHz Gaussian beam, the piezoelectric crystal needs to be ground to a thickness of 30μm, which is time-consuming and laborious, and cannot be mass-produced. In order to realize the vortex sound beam, not only the precise cutting and layout of the array element is required, but also a complex electronic system is required to rea...

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Problems solved by technology

This is because the profile of the beam needs to be designed in order to provide stable capture of particles, but it

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