High strength die thermal insulation board and preparation method thereof

A heat insulation board and high-strength technology, which is applied in the field of high-strength mold heat insulation board and its preparation, can solve the problems of low strength and poor heat insulation effect, and achieve good mechanical strength, enhanced heat insulation effect, and structural density uniform effect

Inactive Publication Date: 2019-07-05
常州创世复合材料有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The technical problem to be solved by the present invention is: in order to solve the technical problem of low strength or poor heat insulation effect of the heat shield in the prior art, the present invention provides a high-strength mold heat shield and its preparation method to solve the above problems

Method used

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  • High strength die thermal insulation board and preparation method thereof
  • High strength die thermal insulation board and preparation method thereof
  • High strength die thermal insulation board and preparation method thereof

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Embodiment Construction

[0043] The present invention will be further described below in conjunction with specific embodiments.

[0044] A method for preparing a high-strength mold heat insulation board, comprising the steps of:

[0045] Step 1: Mixing materials, adding polyester resin and silica powder into the high-speed disperser, then adding curing agent, reinforcing agent and additives, and starting the machine to stir until the mixture is uniform to make a resin compound;

[0046] Step 2: Applying glue, mixing glass fiber cloth or glass fiber mat or glass fiber filament with the resin glue in step 1 in the glue applicator to make a prepreg;

[0047] Step 3: spread and pressurize, lay the prepreg in step 2 layer by layer in the press mold, pressurize and solidify under the conditions of pressure of 2000-3000 tons / square meter and temperature of 100-160°C;

[0048] Step 4: Demoulding, keeping the pressure in the press and forcing cooling for 1 to 1.5 hours, until it is cooled to 80°C and then dem...

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Abstract

The invention discloses a high strength die thermal insulation board and a preparation method thereof. The thermal insulation board comprises following components in percentage by weight: 25 to 40% ofpolyester resin, 30 to 60% of glass fibers, 6 to 12% of silica powder, 0.3 to 0.5% of a curing agent, 7.4 to 18.3% of a reinforcing agent, and 1.3 to 1.5% of an auxiliary agent. The provided thermalinsulation board has a high glass fiber ratio and is manufactured by a lamination pressurizing technology, the heatproof performance and mechanical strength are largely enhanced; functional materialssuch as silica, a reinforcing agent, and the like, are adopted to play reinforcing and structure supporting functions, a gap structure is formed, and thus the thermal insulation effect is greatly improved.

Description

technical field [0001] The invention relates to the technical field of mechanical heat insulation, in particular to a high-strength mold heat insulation board and a preparation method thereof, which are mainly used for rubber and plastic molds, hot presses, and mold heat insulation. Background technique [0002] At present, domestic heat insulation materials are mainly divided into soft and hard. The fields of molds and hot presses require high mechanical strength and good heat insulation effect. Generally, the greater the strength of the material, the worse the heat insulation effect. Most manufacturers use various Insulation boards of similar building materials, but have the defects of insufficient strength and fragility; plastic insulation boards have defects of insufficient temperature resistance, easy softening, and burning; in recent years, some high-end customers have used glass fiber reinforced insulation boards, High strength and high toughness, but poor heat insula...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L67/06C08L71/02C08L91/06C08K13/04C08K7/14C08K3/36C08K3/22C08K5/098C08J5/24
CPCC08J5/24C08J2367/06C08J2471/02C08J2491/06C08K3/22C08K3/36C08K5/098C08K7/14C08K13/04C08K2003/2206C08K2003/222C08K2003/2227
Inventor 倪友琴朱小磊
Owner 常州创世复合材料有限公司
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