Uniform-heat pipe plate phase-change micro refrigerator and manufacturing method thereof

Abstract

The invention relates to a uniform-heat pipe plate phase-change micro refrigerator which comprises an evaporator, a condenser, a cooling water pipe, a glass plate and an outer frame. The evaporator ismanufactured by a silicon surface with a micrometer square pyramid structure and a nanometer hemisphere; the condenser is formed by 12 condensation plates with micrometer V-shaped grooves and cylindrical nanometer structures; and the lower surface of each condensation plate is bonded with the glass plate. An evaporation pond is located on the front surface of the evaporator, and uniformly distributed micrometer square pyramid structures and nanometer hemisphere structures are arranged on the bottom surface of the evaporation pond, so that a double-layer heterogeneous micro-nano secondary structure is formed; the micrometer V-shaped grooves and the nanometer cylindrical double-layer structures are arranged on a condensation surface, the micrometer V-shaped grooves are uniformly distributedon the condensation surface; and the cylindrical nanometer structures are distributed on the surface of the V-shaped grooves at variable spaces, so that a gradient invasive super-hydrophobic liquid drop self-drive surface is formed; and the glass plate and the back surfaces of the condensation plates form the cooling water pipe, and liquid in the evaporation pond and the cooling water pipe are isolated. The invention further comprises a uniform-heat pipe plate phase-change micro refrigerator manufacturing method.

Description

technical field [0001] The invention relates to the technical field of refrigerators, in particular to a uniform heat tube plate phase-change micro-refrigerator and a manufacturing method thereof. Background technique [0002] With the rapid development of microelectronics technology, the main frequency and integration of microprocessor chips are getting higher and higher, resulting in a sharp increase in chip power consumption per unit volume, resulting in a fatal high heat flux problem. The problem of thermal control of chips with high heat flux has become a bottleneck restricting the development of high-integration chip technology. The existing chip-level phase-change microrefrigerator design scheme mainly adopts the vapor chamber scheme. The existing schemes mainly have the following disadvantages: (1) The condensation surface is not a customized drop-like condensation superhydrophobic surface. When steam condenses on a simple silicon surface, it is easy to form film c...

AI Technical Summary

Problems solved by technology

[0004] The present invention aims to overcome the shortcoming of low refrigeration effect existing in the existing uniform temperature plate micro-refrigerator, and proposes a scheme of a uniform heat tube pl

Images