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A Hybrid Analog-to-Digital Converter

A digital converter and mixed-mode technology, applied in the field of data processing, can solve the problems of increasing pixel pitch, low sampling rate, noise disturbance, etc., and achieve the effect of reducing charge loss

Active Publication Date: 2021-04-30
PEKING UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Nowadays, monolithic ADC structure is a mature technology, but its high sampling rate leads to high power consumption and severe noise disturbance, especially when the array size is large
Second, column-level ADCs can provide lower sampling rates, but still have complex parasitic effects
However, conventional folding-integration schemes are often accompanied by the loss of charge
In addition, the counter of the high-resolution ADC will take up huge hardware resources, which means that the pixel pitch has to be increased to accommodate

Method used

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  • A Hybrid Analog-to-Digital Converter
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  • A Hybrid Analog-to-Digital Converter

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Embodiment Construction

[0048] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0049] An embodiment of the present invention provides a hybrid analog-to-digital converter,

[0050] The hybrid analog-to-digital converter is applied in a first readout circuit, and the first readout circuit has an M×N pixel array structure;

[0051] The hybrid analog-to-digital converter includes M×N first-stage ADCs and N second-stage ADCs;

[0052] Each pixel of the pixel array structure is arranged with a first-stage ADC;

[0053] Each column o...

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Abstract

The present invention provides a hybrid analog-to-digital converter, the hybrid analog-to-digital converter is applied in a first readout circuit, and the first readout circuit has an M×N pixel array structure; the hybrid analog-to-digital converter The device includes M×N first-level ADCs and N second-level ADCs; each pixel of the pixel array structure is arranged with a first-level ADC; each column of the pixel array structure is arranged with a second-level ADC Each of the first-level ADCs is connected to the second-level ADC of the column; the first-level ADC is used to transmit the generated high-bit signal to the second-level ADC; the second-level ADC is used After generating the low-order signal, splicing the high-order signal and the low-order signal and reading it out. The embodiment of the present invention uses a two-stage quantization structure, so that the hybrid analog-to-digital converter obtains better charge handling capability and higher linearity compared with the traditional design.

Description

technical field [0001] The invention relates to the technical field of data processing, in particular to a hybrid analog-to-digital converter. Background technique [0002] Cooled infrared focal plane arrays (IRFPAs) for optical imaging are used in a wide variety of different fields. Integrating an analog-to-digital converter (ADC) on an IRFPA has become a growing concern because of its high noise performance, short analog lines, and low system-level hardware cost. Therefore, the demand for high-performance digital readout integrated circuits (DROICs) is increasing today for the small pixel pitches required for the long-wave infrared (LWIR) focal plane. [0003] For IRFPA, three ADC configurations have been developed: monolithic, column-level, and pixel-level. Today, the monolithic ADC structure is a mature technology, but its high sampling rate leads to high power consumption and severe noise disturbance, especially when the array size is large. Second, column-level ADCs...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F30/38
CPCG06F30/327G06F30/36
Inventor 黄兆丰鲁文高朱雅珺牛育泽张盛东陈中建
Owner PEKING UNIV