Antenna packaging structure and method

Abstract

The invention provides an antenna packaging structure and method. The packaging structure comprises a rewiring layer, metal connecting columns, a packaging layer, a first antenna metal layer, a coverbody layer, a second antenna metal layer, an antenna circuit chip and metal bumps, wherein the setting of the cover body layer forms an air chamber structure so as to form an air chamber between the two antenna metal layers, so that the loss between multi-layer antenna structures can be greatly reduced, and the power consumption of the packaging structure is reduced. The three-dimensional packaging mode effectively shortens the signal transmission lines of components in the packaged antenna structure and greatly improves the electrical connection performance and antenna efficiency of the packaged antenna. The metal connecting columns of the antenna can be formed by means of electroplating or chemical plating, so that large-diameter metal connecting columns can be obtained, the structural strength of the metal connecting columns can be improved, and the process deviation can be reduced. Meanwhile, the packaging structure can reduce the feeder loss, improve the efficiency and performanceof the antenna, greatly reduce the loss of the multi-layer antenna structure and thus reduce the manufacturing cost.

Description

technical field [0001] The invention belongs to the field of semiconductor packaging, in particular to an antenna packaging structure and packaging method. Background technique [0002] Due to the progress of science and technology, various high-tech electronic products have been developed to facilitate people's life, including various electronic devices, such as notebook computers, mobile phones, tablet computers (PADs), and the like. [0003] With the popularization of these high-tech electronic products and the increase of people's demand, in addition to the substantial increase of various functions and applications configured in these high-tech products, especially in order to meet people's mobile needs, the function of wireless communication has been added. Therefore, people can use these high-tech electronic products at any place or at any time through these high-tech electronic devices with wireless communication functions. Thereby greatly increasing the flexibility ...

AI Technical Summary

Problems solved by technology

[0006] In view of the above-mentioned shortcomings of the prior art, the object of the present invention is to provide an antenna packaging structure and packaging method, which are used to solve the problems of low efficiency and performance, long transmission signal lines, and high power consumption of the antenna in the prior art. question

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