Detection of foreign particles during wire bonding
A wire bonding, impurity particle technology, applied in image analysis, image enhancement, instrumentation, etc., can solve problems such as unsatisfactory
Pending Publication Date: 2019-07-09
ASM TECH SINGAPORE PTE LTD
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- Application Information
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Problems solved by technology
[0006] While some existing wire bonding machines can perform certain tests to monitor for bond failures, they are still not satisfactory
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[0054] Before discussing the preferred embodiments in more detail, an overview is provided first. The preferred embodiment recognizes that accurately detecting and classifying bonding failures can be problematic. In particular, a type of bonding failure that is difficult to effectively detect is that there may be foreign particles such as dust when bonding is formed, and this short circuit between bonding pads caused by foreign particles causes component failure, usually only It may only be detected during post-package functional testing. And this dust may be generated when the lead frame is transported, and usually it may be caused by the strip copper. The preferred embodiment described herein first detects the possibility of a bond failure ("suspect bond") by determining whether a characteristic measured while forming the bond falls outside the expected range, which would indicate a problem due to the presence of foreign particles. Possible bonding failure. Only when the ...
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A method of bonding wires onto surfaces, an apparatus and a computer program product are disclosed. The method of bonding wires onto surfaces, comprises the steps of: collecting operating characteristics of a bonding tool while forming a wire bond which bonds a wire to a surface; determining whether a possible bonding failure of the wire bond has occurred as indicated by the operating characteristics; and capturing an image of the wire bond to identify whether a foreign body is present on the surface if it is determined that a possible bonding failure has occurred. In this way, imaging of thewire bond is only necessary when the operating characteristics indicate a suspect bonding failure has occurred. This avoids the need to image every bond, while still imaging suspect bonds. This approach helps to significantly increase the throughput of the wire bonding apparatus whilst still identifying and classifying bonding defects due to the presence of a foreign body.
Description
technical field [0001] The present invention relates to a method, apparatus and computer program product for bonding wires to a surface. Background technique [0002] Wire bonding is the process of forming electrical connections in semiconductor components through thin metal wires, typically wires ranging from 12 microns to 500 microns in diameter. Examples of electrical connections that can be made using wire bonding techniques include connections between the contact surfaces of discrete or integrated chips and the contact leads of the chip's packaging, and, in the case of hybrid circuits, between interposed monolithic components and Connections between membrane circuits of elements. [0003] Many wire bonding techniques have been developed, one of which is micro-bonding using ultrasonic waves. The aluminum wire in contact with the contact surface to be bonded moves violently in the direction of the surface to be bonded, breaking its oxide layer. The leads are then compr...
Claims
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IPC IPC(8): H01L21/60H01L21/67
CPCH01L24/85H01L24/78H01L21/67288H01L2224/859H01L2224/789H01L24/45H01L24/48H01L24/49H01L2224/05553H01L2224/0603H01L2224/45124H01L2224/48247H01L2224/48472H01L2224/4903H01L2224/49113H01L2224/78353H01L2224/85205H01L2224/78901H01L2924/00014H01L2924/3701H01L24/05H01L24/06G06T7/0004G06T2207/30152H01L2224/05599G06T2207/30148
Inventor 李浩德黎展祺刘仲恩
Owner ASM TECH SINGAPORE PTE LTD