Two-dimensional plane holographic grating exposure method

A holographic grating, two-dimensional plane technology, applied in the field of two-dimensional plane holographic grating exposure, can solve the problems of low production efficiency and the like

Active Publication Date: 2019-07-12
CHANGCHUN INST OF OPTICS FINE MECHANICS & PHYSICS CHINESE ACAD OF SCI
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  • Application Information

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Problems solved by technology

At present, the commonly used methods are electron beam etching or ion beam etching, etc. These methods have high resolution, but when making one-dimensional or two-dimensional grating topography, the production efficiency is low due to the groove-by-groove production method.

Method used

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  • Two-dimensional plane holographic grating exposure method
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  • Two-dimensional plane holographic grating exposure method

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Embodiment Construction

[0062] In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described here are only used to explain the present application, but not to limit the present application.

[0063] This embodiment provides a two-dimensional planar holographic grating exposure method, including the following steps:

[0064] Step 1: Equipped with an amplitude-divided small-aperture two-dimensional planar holographic grating exposure device, including a laser for emitting light source laser light 1, a half-wave plate 2, a polarizing beam splitting prism 9, a mirror VI12, and a first beam splitting prism 13. First plane mirror 16, second plane mirror 23, first filter collimation system 17, second filter collimation system 24, second beam splitting prism 28, third pla...

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Abstract

The invention relates to the technical field of holographic grating manufacturing, and particularly discloses a two-dimensional plane holographic grating exposure method. The method comprises the steps of: the step 1, arranging an amplitude-splitting small-caliber two-dimensional plane holographic grating exposure device; the step 2, arranging a two-dimensional motion workbench with a laser interferometer; the step 3, arranging a heterodyne two-dimensional interference pattern phase locking device; and the step 4, placing a grating substrate at the preset position of the grating substrate, andmoving the two-dimensional motion workbench to allow the position required being exposed of the grating substrate to move below a two-dimensional interference pattern for exposure. The method can perform one-dimensional or two-dimensional topography scanning exposure without less than the caliber of the interference pattern at any position of the grating substrate, and the area of the manufactured grating is only related to the stroke of the workbench with no need for a large-caliber optical element, and therefore, the two-dimensional plane holographic grating exposure method is suitable forthe exposure of the large-area two-dimensional plane holographic grating.

Description

technical field [0001] The present application relates to the technical field of holographic grating fabrication, in particular to a two-dimensional planar holographic grating exposure method. Background technique [0002] Two-dimensional planar holographic gratings have important applications in high-density magnetic storage and precise measurement of two-dimensional table displacement. The usual two-dimensional planar holographic grating exposure method is to use a one-dimensional grating exposure system for two consecutive exposures, or directly use a double The two-dimensional interference pattern formed by the Loe mirror exposure system is exposed at one time. When the above two exposure methods are used to fabricate large-area two-dimensional planar holographic gratings, the exposure system needs to include a large-diameter collimator lens or a large-area Loey mirror. However, it is very difficult to obtain materials and precision process large-diameter collimator len...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02B5/18
CPCG02B5/1857
Inventor 巴音贺希格宋莹李文昊唐玉国姜珊
Owner CHANGCHUN INST OF OPTICS FINE MECHANICS & PHYSICS CHINESE ACAD OF SCI
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