Inner stereoscopic light projection curing forming 3D printing equipment and forming method thereof

Abstract

Inner stereoscopic light projection curing forming 3D printing equipment mainly comprises a laser projection module, a light reference plane module, a light reference plane module lifting system, a resin tank, a forming platform, a forming platform lifting system, a control system, a power supply system and a body framework. Curing forming is carried out in liquid resin. Multiple beams of light with specific wavelength are used for irradiating photosensitive resin, the unit light strength of each beam of light is lower than that of light required for photosensitive resin curing, but the unit irradiation strength generated after several beams of light coincide is higher than that required for photosensitive resin curing. When the irradiation strength reaches the light intensity required when the photosensitive resin is subjected to a curing reaction, the liquid photosensitive resin of this part can generate a polymerization reaction so as to be cured into solids, and the liquid resin iscontinuously cured from bottom to top according to the cross section of an objected needing to be formed so that a practical object of a model can be obtained.

Description

technical field [0001] The invention relates to the technical field of 3D printing, in particular to a 3D printing device for internal stereoscopic projection solidification molding and a molding method thereof. Background technique [0002] In recent years, the research and application of 3D printer technology has attracted more and more attention from academia and business circles, and it is known as one of the important symbols of the third industrial revolution. Now the traditional 3D printing technology can be roughly divided into different types according to different materials and molding methods: fusion deposition molding (FDM) of plastics, laser sintering or bonded molding of metal powder and plastic powder, photocuring molding of photosensitive resin, and fusion deposition technology. The cost is low, but the speed is very slow and the precision is not high; the laser sintering or bonding of the powder has high precision but the speed is very slow and the cost is h...

AI Technical Summary

Problems solved by technology

The speed of the existing light-curing 3D printing technology is limited by the mechanical equipment itself, which cannot give full play to the maximum performance of the photosensitive resin, so that the molding speed of the equipment is very low, which cannot meet the actual production and manufacturing needs.

For example, the traditional SLA and DLP (LCD) molding technologies are formed on the bottom or surface. Due to the limitation of this structure, the molding platform and the molding object need to continuously move up and down, so the molding speed is greatly reduced. Generally, the fastest will not exceed 50mm / h, and because the molded object is in continuous motion, the molding process is not stable, and the molded object is easy to fall off. In addition, the existence of the concept of layering also makes the precision and surface smoothness of the molded object insufficient

From the perspective of molding speed, the technology with the fastest molding speed in this field is the CLIP (continuously variable liquid level molding) technology of American 3D Carbon Company, and its molding speed is about 8.3 mm per minute Z-axis height (500mm / h), However, compared with the traditional technology, the CLIP technology, which has great advantages, has improved the disadvantages of reciprocating motion on the surface, and also canceled the concept of layers, making the surface of the molded object very smooth, but the liquid at the molding surface The resin needs continuous replenishment and the fluidity of the liquid resin is not good, so it cannot quickly form a large-area solid object, and the speed has been greatly improved compared with the traditional forming technology, reaching the fastest 500mm / h Z-axis molding height, but it is far from meeting the large amount of high-speed manufacturing requirements required in actual industrial production

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