A Force Feedback Closed-loop Control Composite Bonding Device

A closed-loop control, compound key technology, used in semiconductor/solid-state device manufacturing, semiconductor devices, electrical components, etc., can solve the problem that the position parameter control cannot meet the strict requirements of the patch
CN110034032BActive Publication Date: 2020-10-20GUANGDONG UNIV OF TECH
5 Cites 0 Cited by

Patent Information

Authority / Receiving Office
CN Β· China
Patent Type
Patents(China)
Current Assignee / Owner
GUANGDONG UNIV OF TECH
Publication Date
2020-10-20

Smart Images

  • Figure 1
    Figure 1
  • Figure 2
    Figure 2
  • Figure 3
    Figure 3
Patent Text Reader

Abstract

The invention discloses a force feedback closed-loop control composite bonding device. A micro-moving device is driven by a macro-moving device to perform transverse translation and vertical translation; the micro-moving device comprises a giant magnetostrictive actuator, and the length of the giant magnetostrictive actuator is changed to drive a mounting rod to move, and the telescopic amplitudeof the giant magnetostrictive actuator is very small, so that the giant magnetostrictive actuator is used for driving the mounting rod to accurately move in a small range; a strain gauge is used for detecting the contact force between the mounting rod and a substrate; the strain gauge is used for providing feedback for the micro-moving device, and the telescopic amount of the giant magnetostrictive actuator is controlled according to detection signals; when a chip is relatively far away from the substrate, the macro-moving device moves quickly, the macro-moving device is stopped when reachinga relatively close distance from the substrate, the micro-moving device drives the chip to move, and when the chip contacts the substrate, a contact force is generated, and feedback is formed throughthe contact force, so that larger pressure is avoided on the chip; and the macro-moving device or the micro-moving device is used for driving in different stages of mounting, so that the contact force is accurately controlled on the basis of guaranteeing the mounting efficiency, and the chips are prevented from being crushed.
Need to check novelty before this filing date? Find Prior Art

Description

technical field

[0001] The invention relates to the technical field of chip flip chip, and further relates to a force feedback closed-loop control composite bonding device. Background technique

[0002] A flip chip (Flip chip) is a leadless structure that generally contains circuit units. In the field of chip flip chip, chip bonding is the most critical link in flip chip bonding. During the chip bonding process, the chip is carried by the mounting head and transferred to the substrate. Due to the extrusion between the mounting head and the chip, the larger The impact of force can easily cause cracks on the chip, causing the interconnection between the chip and the antenna to fail; in order to ensure the reliability of the paste package, the placement head needs to place the chip behind the substrate pad and press it with a certain contact force for a period of time, but it cannot The chip is crushed during contact.

[0003] The traditional placement head uses the motor to ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More