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A semiconductor package

A semiconductor and substrate technology, applied in the field of semiconductor packaging, can solve the problems of large footprint and large antenna placement area, and achieve the effects of reduced footprint, high gain, and simple layout and wiring

Active Publication Date: 2019-07-19
MEDIATEK INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Also, the high-gain antennas in previous designs required a larger antenna placement area (larger footprint)

Method used

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  • A semiconductor package
  • A semiconductor package
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Embodiment Construction

[0023] Specific terms are used throughout the specification and the following claims to refer to specific components. Manufacturers may refer to components by different names, as those skilled in the art will recognize. This document does not intend to distinguish between those components that have different names but have the same function. In the following description and claims, the terms "comprising" and "comprising" are used in an open-ended category and should therefore be construed to mean "including, but not limited to...". Also, the term "coupled" is intended to mean an indirect or direct electrical connection. Thus, if a device couples to another device, that connection may be a direct electrical connection or an indirect electrical connection via other devices and connections.

[0024] The following description is of the best contemplated mode of carrying out the invention. This description is intended to illustrate the general principles of the invention and not...

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Abstract

A semiconductor package includes a substrate having thereon at least an antenna layer and a ground reflector layer under the antenna layer, a radio frequency (RF) die disposed on or in or below the substrate, a medium layer disposed on the antenna layer of the substrate, and a frequency-selective surface (FSS) structure disposed on the medium layer. In the structure, only few antenna layers need to be used, so that the feed-in network between the antenna layers and the RF die is relatively simple, a complex feed-in network is not needed, the packaging layout and wiring are simpler, and the line interference and the like are reduced; and the occupied area of the antenna layers can be reduced by using fewer antenna layers, so that the packaging size can be reduced.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a semiconductor package. Background technique [0002] Over the past few years, the demand for low-cost, high-performance, compact radar systems for millimeter-wave (mm-wave) applications has increased. Therefore, the development of Antenna-in-Package (AiP, Antenna-in-Package) becomes more important. [0003] As known in the art, the design of the AiP has focused on how to achieve high gain and good control of the radiation pattern. However, it is becoming increasingly difficult to accommodate ever smaller and thinner packages while maintaining antenna performance. [0004] The high-gain antenna design in the prior art generally requires multiple radiating elements to form an antenna array, and requires a complex feeding network for processing transmit / receive radio frequency (RF) signals. Additionally, the high-gain antennas in previous designs required a larger antenn...

Claims

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Application Information

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IPC IPC(8): H01L23/31H01L23/66H01Q1/22H01Q15/00
CPCH01L23/66H01L23/31H01Q1/2283H01Q15/0013H01L2223/6677H01Q15/10H01Q19/062H01L2224/04105H01L2224/12105H01L2224/73267H01L23/3128H01L23/3114H01L2224/02381H01Q21/065H01L2224/02379H01L23/145
Inventor 邱诗家吕彦儒吴文洲陈南诚
Owner MEDIATEK INC
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