Thin film encapsulation structure, OLED (organic light emitting diode) display panel and manufacturing method thereof
A thin-film encapsulation and display panel technology, applied in semiconductor/solid-state device manufacturing, electrical components, electrical solid-state devices, etc., can solve problems such as loss and aging, decrease in the ability of organic film layers to buffer stress, and limit the service life of foldable mobile phones, etc. Achieve the effect of avoiding wear and aging and improving bending ability
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[0036] The description of the following embodiments refers to the attached drawings to illustrate specific embodiments in which the present invention can be implemented. The directional terms mentioned in the present invention, such as [Up], [Down], [Front], [Back], [Left], [Right], [Inner], [Outer], [Side], etc., are for reference only The direction of the additional schema. Therefore, the directional terms used are used to describe and understand the present invention, rather than to limit the present invention. In the figure, units with similar structures are indicated by the same reference numerals.
[0037] First, the prior art will be briefly explained. See figure 1 , figure 1 It is a comparative schematic diagram of the thin film packaging structure in the prior art before and after bending. Existing thin film packaging structures often include a film layer structure composed of a first inorganic thin film 102, a first organic thin film 104, and a second inorganic thin ...
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