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Thin film encapsulation structure, OLED (organic light emitting diode) display panel and manufacturing method thereof

A thin-film encapsulation and display panel technology, applied in semiconductor/solid-state device manufacturing, electrical components, electrical solid-state devices, etc., can solve problems such as loss and aging, decrease in the ability of organic film layers to buffer stress, and limit the service life of foldable mobile phones, etc. Achieve the effect of avoiding wear and aging and improving bending ability

Active Publication Date: 2019-07-23
WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For foldable flexible devices, after multiple folds, the organic film layer in TFE will inevitably experience loss and aging, and cracks will appear on the outer curved surface, resulting in a serious decline in the stress buffering capacity of the TFE organic film layer, which limits the foldability. Lifespan of the phone

Method used

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  • Thin film encapsulation structure, OLED (organic light emitting diode) display panel and manufacturing method thereof
  • Thin film encapsulation structure, OLED (organic light emitting diode) display panel and manufacturing method thereof
  • Thin film encapsulation structure, OLED (organic light emitting diode) display panel and manufacturing method thereof

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Embodiment Construction

[0036] The following descriptions of the various embodiments refer to the accompanying drawings to illustrate specific embodiments in which the invention may be practiced. The directional terms mentioned in the present invention, such as [top], [bottom], [front], [back], [left], [right], [inside], [outside], [side], etc., are only for reference The orientation of the attached schema. Therefore, the directional terms used are used to illustrate and understand the present invention, but not to limit the present invention. In the figures, structurally similar elements are denoted by the same reference numerals.

[0037] First, the prior art is briefly described. see figure 1 , figure 1 It is a comparative schematic diagram of the thin film packaging structure in the prior art before and after bending. Existing thin film packaging structures often include a film layer structure composed of a first inorganic thin film 102 , a first organic thin film 104 and a second inorganic ...

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Abstract

The invention provides a thin film encapsulation structure, an OLED (organic light emitting diode) display panel and a manufacturing method thereof. The thin film encapsulation structure comprises a first inorganic thin film, a first organic thin film and a second inorganic thin film; the first organic thin film is located on the first inorganic thin film; the second inorganic thin film covers thefirst organic thin film and the first inorganic thin film, wherein the material forming the first organic thin film is an organic polymer with self-repairing capability. According to the thin film encapsulation structure, the OLED display panel and the manufacturing method thereof provided by the invention, loss and aging of organic film layers in TFE (thin film encapsulation) can be delayed.

Description

technical field [0001] The invention relates to the field of electronic display, in particular to a thin film packaging structure, an OLED display panel and a manufacturing method thereof. Background technique [0002] Organic light emitting diode (OLED) devices have the advantages of light weight, wide viewing angle, fast response time, high luminous efficiency, etc., and have great application prospects. In addition, OLED devices can be fabricated on flexible substrates to form flexible display screens that can be bent, so that OLED display panels have greater advantages over traditional liquid crystal panels. [0003] In order to ensure the bendability of OLED devices, thin film encapsulation (thin filmencapsulation, TFE) technology is usually used to package them at present. TFE often adopts an inorganic / organic / inorganic overlapping film structure. The inorganic film layer is used as a water and oxygen barrier layer, and the organic film layer is used as a buffer laye...

Claims

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Application Information

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IPC IPC(8): H01L51/52H01L51/56
CPCH10K50/8426H10K71/00
Inventor 孙佳佳
Owner WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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