Vehicle Electronics
A vehicle-mounted electronic, conductive technology, applied in circuit devices, printed circuit grounding devices, mounting board safety devices, etc., to solve problems such as electromagnetic interference
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Embodiment approach 1
[0036] Hereinafter, a partial cross-sectional view of the in-vehicle electronic device according to Embodiment 1 is figure 1 ,and figure 1 An exploded perspective view of the structure of the circuit board viz. figure 2 , detailing its structure. figure 1 Among them, the in-vehicle electronic device 100A includes a metal (conductive) base 110A, and a multilayer circuit board 140A hermetically housed in a frame made of a resin (non-conductive) cover 120A. The base 110A and the cover 120A The peripheral portion is sealed by a waterproof sealing material 130. Mounting and fixing portions 111 are integrated at, for example, four corners of the base 110A, and the mounting and fixing portions 111 are fastened to a mounted surface 160 provided on the vehicle body side with mounting members 161 such as screws. In addition, a shelf step portion 112 is provided on the outer three sides of the substrate 110A to mount the multilayer circuit board 140A, and a fitting groove portion 113...
Embodiment approach 2
[0061] Regarding the structure of Embodiment 2 of the vehicle-mounted electronic device, using a partial cross-sectional view that is Figure 4 ,and Figure 4 The exploded perspective view of the circuit board shown is the Figure 5 , with figure 1 and figure 2 The different points of the structure will be explained in detail. In addition, in each figure, the same reference numerals represent the same or corresponding parts, and the in-vehicle electronic device 100A becomes the in-vehicle electronic device 100B, and the differences in the embodiments are indicated by capital letters at the end of the reference numbers. Figure 4 and Figure 5 in, with figure 1 and figure 2 The main difference is that the mounted surface 160 of the substrate 110A and the substrate 110B is a conductor or an insulator, and the selection layer for the peripheral protection pattern 34x is changed from the solder resist film 34c (in the case of the substrate 110A) to a solder film 39 (case ...
Embodiment approach 3
[0067] A partial cross-sectional view of Embodiment 3 of an in-vehicle electronic device is Figure 7 ,and Figure 7 The exploded perspective view of the circuit board shown is the Figure 8 , with figure 1 and figure 2 The different points of the structure center on the detailed description of its structure. In addition, in each figure, the same reference numerals represent the same or corresponding parts, and the in-vehicle electronic device 100A becomes the in-vehicle electronic device 100C, and capital letters at the end of the reference numbers are used to indicate differences in the embodiments. exist Figure 7 and Figure 8 in, with figure 1 and figure 2 The main difference is that the outer cover 120C made of metal is used instead of the outer cover 120A made of resin. Regarding the installation of the base 110C, both the case of conductive mounting on the vehicle body and the case of insulating mounting on the vehicle body will be described together. . Alon...
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