Curable organopolysiloxane composition, and protection agent or adhesive composition for electrical/electronic components

A polysiloxane, curable technology, used in non-polymer adhesive additives, semiconductor/solid-state device parts, electrical components, etc., to achieve excellent reliability and durability, high adhesive strength, and maintain reliability and durability effect

Active Publication Date: 2019-08-02
DOW TORAY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] The present invention is made to solve the above-mentioned problems, and its object is to provide a curable organopolysiloxane composition that can be easily cured by heating from room temperature to 50°C, especially when applied in a small amount or in a thin layer. Initial adhesion to various substrates in contact with during curing, especially unwashed die-cast aluminum parts, polybutylene terephthalate (PBT) resin, polyphenylene sulfide (PPS) resin and other organic resins Excellent adhesion, high adhesive strength can be achieved after curing, and problems such as peeling are not easy to occur

Method used

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  • Curable organopolysiloxane composition, and protection agent or adhesive composition for electrical/electronic components
  • Curable organopolysiloxane composition, and protection agent or adhesive composition for electrical/electronic components
  • Curable organopolysiloxane composition, and protection agent or adhesive composition for electrical/electronic components

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Embodiment

[0187] Hereinafter, the present invention will be described with reference to examples, but the present invention is not limited thereto. In addition, the adhesiveness of the curable organopolysiloxane composition was evaluated according to the following method.

[0188]

[0189] The silicone adhesive compositions shown in Table 1, Table 2 below were prepared. Specifically, the following components (A-1), (A-2), (H-1), and (H-2) are mixed in advance, and then components (E) and (F) are added, and the defoaming process is carried out after sufficient stirring , to prepare liquid I components. And, the following (A-1), (A-2), (J-1), (J-2), (H-1), (H-2) components are mixed in advance, then add (B), ( After components C), (D), (G-1), (G-2) and (I) are fully stirred, a defoaming process is carried out to prepare II liquid components. Each of the solutions obtained by the above method was filled into a plastic 2-column cartridge (cartridge) manufactured by MIX-PAC Co., Ltd., ...

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Abstract

To provide a curable organopolysiloxane composition, etc. which has a particularly excellent effect of improving initial adhesiveness in small amounts and a thin layer with respect to various base materials, in addition to being able to achieve particularly excellent adhesive durability and high adhesive strength after curing. A curable organopolysiloxane composition, containing:(A) an organopolysiloxane having at least two alkenyl groups per one molecule; (B) a trialcoxysilyl containing siloxane having one silicon atom-bonded hydrogen atom and at least one trialcoxysilyl group per one molecule; (C) a chain or cyclic organopolysiloxane having at least two silicon atom-bonded hydrogen atoms per one molecule; (D) a chain organopolysiloxane having at least three silicon atom-bonded hydrogen atoms per one molecule; (E) a catalyst for a hydrosilylation reaction; (F) a catalyst for a condensation reaction; and (G) an adhesion promoter.

Description

technical field [0001] The present invention relates to a curable organopolysiloxane composition which is easily cured by heating from room temperature to 50° C. and which is particularly excellent in adhesion to various substrates in the form of a thin layer, and further relates to a curable organopolysiloxane composition composed of the A protective agent or an adhesive composition for electric and electronic parts composed of a curable organopolysiloxane composition, and an electric and electronic device in which electric and electronic parts are encapsulated or sealed with these curable organopolysiloxane compositions. Background technique [0002] Curable organopolysiloxane compositions are widely used as protective agent compositions for electrical and electronic parts, and from the viewpoint of their reliability and durability as protective materials, they are required to be effective on the substrates they contact during the curing process Has excellent self-adhesive...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/07C08L83/04C08L83/05C09J11/06C09J183/04C09J183/05C09J183/07H01L23/29H01L23/31
CPCC08G77/12C08G77/20C08G77/18H01L23/296C09J183/04C08L83/00C08K5/56C08K5/5419C09D183/04C08K3/013C08G77/08C08K5/5415C08K5/5435C08K5/544C08L83/04C09J11/06H01L23/29H01L23/31H05K5/065C08L2203/206C08L2205/025C08L2205/035
Inventor 藤泽豊彦大西正之
Owner DOW TORAY CO LTD
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